Abstract: A portable air conditioner comprises a tank for storing a liquid therein, a plurality of tubes, and at least one fin disposed between adjacent tubes. The tubes are spaced from one another defining an air passageway therebetween having an air inlet and a dry air outlet. Each tube has a first end extending into the tank in fluid communication with the liquid and a second end extending opposite the tank defining a wet air outlet and a wicking material disposed therein and in fluid communication with the liquid. A sheet valve sealingly engages the dry air outlet and the wet air outlet and is moveable for adjusting an amount of air flow exiting from the dry air outlet and the wet air outlet. At least one aperture is defined within each of the tubes between the ends to divert air flowing through the air passageway into the tubes.

Abstract: A thermosiphon cooling assembly cools an electronic device with a conical condensing tube disposed about a curved central axis curving upwardly from a top of the evaporating unit to an upper distal end and a shroud disposed outward of an exterior surface of the condensing tube at the upper distal end extending axially along the central axis from the upper distal end to a lower edge spaced from the top defining an air opening. An air moving device moves air about the central axis within the shroud to the air opening. A plurality of condensing fins are disposed in the condensing tube and each condensing fin forms a pair of corners with an interior surface of the condensing tube and a wick material is disposed in each of the corners to return condensed vapor to the evaporating unit.

Abstract: A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between the housing top and the housing bottom to define a low profile entrance and a low profile exit. A refrigerant is disposed within one or more boiling chambers. Heat generated by the electronic device is transferred to the refrigerant by the boiling chambers for liquid-to-vapor transformation. Condenser tubes having a bottom end and a top end extend from the boiling chambers at a diagonally upward angle across the sides between the housing bottom and housing top. The condenser tubes receive and condense vapor boiled off from the refrigerant. Air moving devices axially move air through the housing. Air is flowed across the condenser tubes to facilitate condensation.

Abstract: An orientation insensitive heat exchanger assembly includes a housing having an upper portion including condensing tubes extending upwardly and intersecting a top wall of the lower portion. The condensing tubes are spaced equally from one another circumferentially and radially from the central axis and extend outwardly at a predetermined angle from the central axis. A fan assembly is disposed along a central axis extending upwardly from a center of the housing wherein the condensing tubes surround the fan assembly and the fan moves air radially out through the spaces between the condensing tubes.

Abstract: A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device during the liquid-to-vapor-to-condensate cycle. The mixing device may include a vapor stirrer disposed above the liquid of the refrigerant and/or a liquid stirrer disposed in the liquid of the refrigerant for moving the liquid of the refrigerant over a boiler plate.

Abstract: The invention provides a heat exchanger assembly for cooling an electronic device wherein the upper portion of the housing includes a plurality of condensing tubes extending upwardly from the lower portion of the housing. A plurality of air heat transfer fins zigzag transversely to a primary axis (A) between adjacent ones of the condensing tubes for dissipating heat from vapor boiled off of the refrigerant. At least two next adjacent condensing tubes of the plurality diverge upwardly from the bottom ends toward the top distal ends thereof. Accordingly, the space containing the air heat transfer fins between the two next adjacent condensing tubes is greater at the top distal ends than at the bottom ends of the condensing tubes. The condensing tubes can either have a constant cross-section with diverging tube axes or can have a decreasing cross-section from bottom to top with parallel tube axes.

Abstract: The invention provides a fluid heat exchange assembly comprising a housing containing a liquid refrigerant presenting a surface. A tube is coiled in adjacent coils around an axis parallel to the surface of the liquid refrigerant with a first sector of each coil disposed below the liquid surface and a second sector of each coil disposed above the liquid surface whereby said tube runs into and out of said liquid refrigerant.

Abstract: A thermosiphon cooling assembly cools an electronic device with a first refrigerant disposed in the lower boiling chamber of a housing for liquid-to-vapor transformation and a second refrigerant disposed in an upper evaporating chamber of a housing for liquid-to-vapor transformation. The partition separating the lower boiling chamber of the housing from the upper evaporating chamber of the housing creates a series of vapor chambers within the lower boiling portion for condensing vapor boiled off the first refrigerant. The upper evaporating chamber contains a series of refrigerant pockets interleaved vertically with the vapor chambers to increase the surface area for heat transfer between the refrigerant vapor and the second refrigerant for absorbing heat by the second refrigerant for liquid-to-vapor transformation.

Abstract: A thermosiphon cooling assembly includes a housing having a lower portion and an upper portion. A refrigerant is disposed in the lower portion for liquid-to-vapor transformation. A boiler plate defines an outer bottom wall of the housing for transferring heat from the electronic device to the refrigerant. This transfer of heat to the refrigerant leads to a liquid-to-vapor transformation and a pressure build up in the housing. The boiler plate is flexible for reacting with the electronic device in response to the pressure build up in the housing. The boiler plate includes an inflexible first area for overlying the electronic device and a flexible second area which surrounds the first area of the boiler plate. The second area has a thickness t2 less than the thickness t, of the first area thus allowing the boiler plate to flex in the second area.

Abstract: An automotive air conditioning system is disclosed comprising an evaporative cooler in series with the conventional vapor compression system. The evaporative cooler comprises an array of dry channels and a contiguous array of wet channels. The primary air stream to be conditioned by the evaporator of the conventional air conditioning system is preconditioned by the evaporative cooler by lowering its dry bulb temperature without changing its absolute humidity. An evaporator core is supported downstream of the evaporative cooler for receiving the primary air from the dry channels and thereby produces liquid condensate. The system is distinguished by conducting the liquid condensate from the evaporator core to the wicking tank for use in the wet channels of the evaporative cooler.

Abstract: The invention provides a heat sink for flowing coolant into inlet manifold channels extending into a inlet edge of a manifold where the flow is forced downward into parallel and spaced micro-channels extending across the manifold channels and re-directing the coolant up into and out of outlet manifold channels extending into an outlet edge of the manifold and interleaved with the inlet manifold channels, and by maintaining a base-width of the micro-channels in the range of forty microns to one hundred microns, maintaining a base-height of the micro-channels in the range of two hundred microns to four hundred microns, maintaining a manifold-height through of the manifold channels in the range of one thousand microns to three thousand microns, and maintaining a manifold-width of the manifold channels in the range of three hundred and fifty microns to one thousand microns.

Abstract: A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of projections with linear cavities between adjacent projections so that fluid flows into and out of the cavities as the fluid flows across the rows of projections for contraction and expansion of the coolant flow to maximize heat transfer. The projections may be rectangular, triangular or convex, as viewed in cross section.

Abstract: A computer assembly including a casing having a bottom and end walls and side walls and a lid and a variety of computer components are supported on the bottom. A partition extends between the side walls and a plurality of fans is disposed in the partition for moving air through perforations in the end walls. A heat exchanger includes fins and each fan has a central hub and fan blades extending radially therefrom. In the embodiment of FIGS. 1 and 2, the fans move air into said fins and a flow straightener is disposed between the hub of each fan and the fins for straightening flow downstream of the hub prior to entering said fins. In the embodiment of FIGS. 3 and 4, the fans move air through the fins and into a flow deflector over each hub of the fan for diverting flow from the fins and around the hubs prior to entering the fans.

Abstract: The subject invention provides a heat sink for cooling electronic devices. The heat sink includes an upper chamber and a lower chamber separated by a baffle therebetween. The lower chamber includes a base having a central axis and a plurality of curvilinear fins disposed radially about the central axis of the base. The upper chamber includes a lid defining an inlet and an inlet tube interconnecting the upper chamber and the lower chamber for directing a fluid through the upper chamber and impinging the fluid on the base in the lower chamber. A sidewall extends between the base and the lid and is disposed about the fins. The sidewall includes a peripheral inlet for directing the fluid perpendicular to the central axis and at the fins.

Abstract: The subject invention provides a heat sink for a liquid cooling system. The heat sink includes a spreader plate for contacting an electronic device and a body having a plurality of channels extending through the body and arranged in layers. Each layer includes a quantity of the channels decreasing in number with an increase in the distance from the electronic device, thus giving the heat sink a trapezoidal cross section perpendicular to the channels.

Abstract: An electronics cabinet for storing a plurality of electronic devices therein is provided and includes a fan and an evaporative cooler. The fan draws a flow of air into the cabinet, circulates the flow of air through the evaporative cooler, and then across the electronic devices for removing heat produced by the electronic devices. The evaporative cooler removes heat from the flow of air by absorbing heat from the flow of air and then dissipating the heat by evaporating a liquid into a secondary airflow, which is directed out of the cabinet. The cabinet includes a cold air plenum having an actuator for adjusting a cross-sectional area of the cold air plenum to control the airflow through each of the supports.

Abstract: An indirect evaporative cooler assembly includes staggered wet and dry channels. An electric fan moves air through the assembly. Air passes through the wet channels where a material wicks moisture stored in a reservoir into the wet channels. As a result, the side walls of the wet channels are evaporatively cooled. Air moving through dry channels is cooled by the cooling of the walls of the wet channels, and by the presence of louvered convoluted fins in the dry channels that allow for air circulation and further heat dissipation. The wet channels are distinguished by the presence of an electrolyte saturating the material, and electrodes disposed on either side of the material combined to generate an electrical current. Pairs of electrodes are connected in series, and generate electricity to power the electric fan. An auxiliary power source is activated when the voltage from the electrodes drops below a pre-determined level.

Abstract: A heat pump is operable in a heating mode and a cooling mode and includes two identical heat exchangers. The heat exchangers alternate between operating as a condenser and an evaporator as the heat pump switches between the heating mode and the cooling mode. The heat exchangers include a fluid passageway for directing a refrigerant therethrough and a bypass bisecting the fluid passageway into a first portion and a second portion. A valve interconnects the first portion and the second portion of the fluid passageway and the bypass for directing the refrigerant through the first portion of the fluid passageway and into the bypass to prevent refrigerant flow through the second portion of the fluid passageway when the heat exchanger is operable as the evaporator.

Abstract: A heat sink removes heat from an electronic device and comprises a base, a lid. An inner ring of first fins extend radially outwardly first length from an inner circle and extend axially a first height from the top surface of the base, and an outer ring of second fins extend radially inwardly a second length from an outer periphery and extend axially a second height from the top surface of the base. A confining plate extends radially above the fins and is spaced below the bottom surface of the lid whereby coolant fluid flows from an inlet opening of the lid through the center opening of the confining plate and radially outwardly through the fins and upward around the outer edge of the confining plate and into the space above the confining plate to an outlet opening. A nozzle having a throat is disposed above the lid and extends below the lid to the confining plate. A flow diverter extends upwardly from the top surface of the base and into and through the throat of the nozzle.

Abstract: A heat sink assembly for removing heat from an electronic device and comprising a base, a lid in spaced relationship with and parallel to the base, and an outer wall spiraling radially outwardly about an inlet axis from an inner exit position to an outer exit position to define a tangential outlet between said exit positions. Each of a plurality of curved fins presents a concave surface and a convex surface and extends from an inner circle with radius concentric with the inlet axis to an outer circle with radius concentric with the inlet axis to define a plurality of curved channels between adjacent fins for directing the flow of cooling fluid radially from the inlet axis. Each of the curved channels is disposed at a constant distance between next adjacent fins for a major length there along from the inner circle with radius toward the outer circle with radius.