Patents by Inventor Mohinder Singh

Mohinder Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070284092
    Abstract: Three embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS. 1-2, 3 and 4 and each comprises a flange, a dome, a plurality of condensing tubes, a shroud, and a boiler plate. In the first embodiment shown in FIG. 1, the dome is semi-spherical in shape and the distance measured axially along the center axis equals the distance measured laterally from or perpendicular to the center axis. In the second and third embodiments shown in FIGS. 3 and, 4, respectively, the distance measured axially along the center axis is greater than the distance measured laterally from or perpendicular to the center axis. The domes in the second and third embodiments are an ellipsoid and a semi-logarithmic body, respectively. In all embodiments, a plurality of condensing tubes aligned in fan rows and arced rows extend from the dome to distal ends to facilitate more-efficient heat transfer.
    Type: Application
    Filed: May 23, 2006
    Publication date: December 13, 2007
    Inventors: Debashis Ghosh, Mohinder Singh Bhatti
  • Patent number: 7305834
    Abstract: The invention provides an apparatus for moving thermal energy with respect to at least one of a beverage and a food product positioned in a vehicle or a stationary beverage machine. The apparatus includes a vortex tube positionable in a vehicle or a stationary beverage machine. The vortex tube includes an inlet and a cold outlet and a hot outlet. The vortex tube divides a primary air stream received in the inlet into a cold air sub-stream exiting the cold outlet and an a hot air sub-stream exiting the hot outlet. The apparatus also includes a containing member having a first wall with an inner surface for receiving a product. The containing member also includes a second wall surrounding the first wall to define a first cavity. The apparatus also includes a first fluid line extending between the first cavity and one of the cold and hot outlets for communicating one of the cold and hot air sub-streams to the first cavity.
    Type: Grant
    Filed: January 21, 2005
    Date of Patent: December 11, 2007
    Assignee: Delphi Technologies, Inc
    Inventor: Mohinder Singh Bhatti
  • Publication number: 20070272397
    Abstract: A closed loop liquid cooling unit for dissipating heat from an electronic device includes a housing having a bottom and a top. Opposing sides extend along a housing axis (AH) between an open entrance end and an open exit end. The cooling unit further includes a cold-plate and a heat exchanger having a plurality of cooling tubes that extend between headers. A pump and a plurality of hoses circulate liquid. A heat exchanger axis (AHEX) extends diagonally across the housing at an acute angle to the housing axis (AH). The heat exchanger axis (AHEX) defines a wedge-shaped entrance air plenum and a wedge-shaped exit air plenum. The headers are sealed for directing air through the air passages and across the cooling tubes. The pump is disposed within the wedge-shaped entrance air plenum.
    Type: Application
    Filed: May 23, 2006
    Publication date: November 29, 2007
    Inventors: Ilya Reyzin, John Lawrence Pawlak, Mohinder Singh Bhatti
  • Publication number: 20070272392
    Abstract: Two embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS. 1 and 3 and each comprises a housing, a plurality of high fins, a plurality of low fins, a nozzle plate, an inlet, at least one outlet, a primary nozzle, and a plurality of secondary nozzles. In the first embodiment shown in FIG. 1, the housing and the nozzle plate are circular in shape. In the second embodiment shown in FIG. 3, the housing and the nozzle plate are rectangular in shape. Both embodiments include a plurality of secondary nozzles that are aligned outwardly of the primary nozzle and the center axis of the nozzle plate. The secondary nozzles direct the flow of the cooling liquid outwardly of the primary nozzle from the center thus creating an overall system pressure drop lower than that of other assemblies without a plurality of secondary nozzles.
    Type: Application
    Filed: May 23, 2006
    Publication date: November 29, 2007
    Inventors: Debashis Ghosh, Mohinder Singh Bhatti
  • Publication number: 20070267182
    Abstract: A heat exchanger assembly is provided including a primary housing having a plurality of primary condensing fingers extending upwardly from and perpendicular to a horizontal axis and disposed circumferentially about a primary axis. A tube extends radially from the primary axis along the horizontal axis toward a remote housing including remote condensing fingers extending downwardly from and perpendicular to the horizontal axis. The remote condensing fingers are disposed circumferentially about a remote axis extending vertically through the remote housing. The tube interconnects the primary housing and the remote housing and is flexible to facilitate movement of the housings relative to one another.
    Type: Application
    Filed: May 16, 2006
    Publication date: November 22, 2007
    Inventors: David P. Rusch, Mohinder Singh Bhatti, Ilya Reyzin
  • Patent number: 7281390
    Abstract: An indirect evaporative cooler assembly includes staggered wet and dry channels. An electric fan moves air through the assembly. Air passes through the wet channels where a material wicks moisture stored in a reservoir into the wet channels. As a result, the side walls of the wet channels are evaporatively cooled. Air moving through dry channels is cooled by the cooling of the walls of the wet channels, and by the presence of louvered convoluted fins in the dry channels that allow for air circulation and further heat dissipation. The wet channels are distinguished by the presence of an electrolyte saturating the material, and electrodes disposed on either side of the material combined to generate an electrical current. Pairs of electrodes are connected in series, and generate electricity to power the electric fan. An auxiliary power source is activated when the voltage from the electrodes drops below a pre-determined level.
    Type: Grant
    Filed: September 9, 2005
    Date of Patent: October 16, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Donald John Enzinna
  • Patent number: 7278468
    Abstract: The subject invention provides a heat sink for cooling electronic devices. The heat sink includes an upper chamber and a lower chamber separated by a baffle therebetween. The lower chamber includes a base having a central axis and a plurality of curvilinear fins disposed radially about the central axis of the base. The upper chamber includes a lid defining an inlet and an inlet tube interconnecting the upper chamber and the lower chamber for directing a fluid through the upper chamber and impinging the fluid on the base in the lower chamber. A sidewall extends between the base and the lid and is disposed about the fins. The sidewall includes a peripheral inlet for directing the fluid perpendicular to the central axis and at the fins.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: October 9, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Shrikant Mukund Joshi, Mohinder Singh Bhatti
  • Patent number: 7280363
    Abstract: The invention provides a heat sink device for receiving heat generated by an electrical chip. The heat sink device includes a cold plate having a bottom surface for receiving heat from the electrical chip and a top surface opposite of the bottom surface. The heat sink device also includes a finger member having a rounded tip centered on the top surface. The heat sink device also includes a force generating device having an anvil spaced from the finger member and a compressible member compressed between the anvil and the finger member. The compressible member generates a pressing force urging the finger member and the top surface together. The heat sink device also includes a moving device operable to move one of the anvil and the finger member relative to the other to change the pressing force generated by the compressible member.
    Type: Grant
    Filed: January 21, 2005
    Date of Patent: October 9, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Ilya Reyzin, Mohinder Singh Bhatti, Lawrence P. Scherer, Andrew R. Hayes, Shrikant Mukund Joshi
  • Patent number: 7278471
    Abstract: The subject invention provides a heat sink for a liquid cooling system. The heat sink includes a spreader plate for contacting an electronic device and a body having a plurality of channels extending through the body and arranged in layers. Each layer includes a quantity of the channels decreasing in number with an increase in the distance from the electronic device, thus giving the heat sink a trapezoidal cross section perpendicular to the channels.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: October 9, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Shrikant Mukund Joshi
  • Patent number: 7267162
    Abstract: The invention provides a heat exchanger having a plurality of plates stacked in alternating mirrored relation with one another. Each of the plurality of plates has a plate length extending along a plate longitudinal axis between first and second ends. Each of the plurality of plates also has a plate width extending transverse to the plate longitudinal axis. The plurality of plates cooperate to define a fluid receiving cavity extending along a receiving axis substantially perpendicular to the plate longitudinal axis. The plurality of plates also cooperate to define a fluid exiting cavity extending along an exiting axis substantially perpendicular to the plate longitudinal axis and spaced from the receiving axis. A plurality of plate cavities are defined between alternating pairs of adjacent plates and extend along the plate length. The plurality of plate cavities fluidly communicate with both of the receiving and exiting cavities.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: September 11, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Mingyu Wang, Lin-Jie Huang, Gary Scott Vreeland
  • Patent number: 7269011
    Abstract: A heat sink assembly for removing heat from an electronic device and comprising a base, a lid in spaced relationship with and parallel to the base, and an outer wall spiraling radially outwardly about an inlet axis from an inner exit position to an outer exit position to define a tangential outlet between said exit positions. Each of a plurality of curved fins presents a concave surface and a convex surface and extends from an inner circle with radius concentric with the inlet axis to an outer circle with radius concentric with the inlet axis to define a plurality of curved channels between adjacent fins for directing the flow of cooling fluid radially from the inlet axis. Each of the curved channels is disposed at a constant distance between next adjacent fins for a major length there along from the inner circle with radius toward the outer circle with radius.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: September 11, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Debashis Ghosh, Shrikant Mukund Joshi
  • Patent number: 7263848
    Abstract: A heat pump is operable in a heating mode and a cooling mode and includes two identical heat exchangers. The heat exchangers alternate between operating as a condenser and an evaporator as the heat pump switches between the heating mode and the cooling mode. The heat exchangers include a fluid passageway for directing a refrigerant therethrough and a bypass bisecting the fluid passageway into a first portion and a second portion. A valve interconnects the first portion and the second portion of the fluid passageway and the bypass for directing the refrigerant through the first portion of the fluid passageway and into the bypass to prevent refrigerant flow through the second portion of the fluid passageway when the heat exchanger is operable as the evaporator.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: September 4, 2007
    Assignee: Delphi Technologies, Inc.
    Inventor: Mohinder Singh Bhatti
  • Patent number: 7228989
    Abstract: The invention provides a vending machine for cooling food products. The vending machine includes a housing defining an interior. The vending machine also includes a plurality of holding members substantially thermally isolated from one another and disposed in the interior. Each of the plurality of holding members includes inner and outer hollow members telescopically engaged with one another to define an inner cavity with an opening operable to communicate an individual food product and an outer cavity with an inlet and an outlet spaced from the inlet. The vending machine also includes a refrigeration system disposed outside of the interior and fluidly communicating individually with each of the outer cavities to cool each of the inner cavities.
    Type: Grant
    Filed: April 13, 2005
    Date of Patent: June 12, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Mingyu Wang, David P. Rusch
  • Patent number: 7213636
    Abstract: The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of cooling fluid onto the fins and is disposed above the base plate and below the top extremity of the fins. The flow of cooling fluid is discharged from the nozzle adjacent the base plate and then flows upwardly through the fins to remove the heat from the base plate before removing any heat from the fins.
    Type: Grant
    Filed: March 15, 2005
    Date of Patent: May 8, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Shrikant Mukund Joshi, Ilya Reyzin
  • Patent number: 7204299
    Abstract: A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of projections with linear cavities between adjacent projections so that fluid flows into and out of the cavities as the fluid flows across the rows of projections for contraction and expansion of the coolant flow to maximize heat transfer. The projections may be rectangular, triangular or convex, as viewed in cross section.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: April 17, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Shrikant Mukund Joshi, Ilya Reyzin
  • Patent number: 7199078
    Abstract: An automobile exhaust system includes a catalytic converter and a modified NOx trap wit improved sulfur tolerance. Sulfur oxide has a deleterious effect on the performance of nitrogen oxide traps. In the modified NOx trap, a sulfur oxide trap is integrated with a nitrogen oxide trap by coating the catalyst contained within a nitrogen oxide trap with a mixed oxide layer of calcium oxide and magnesium oxide. The NOx trap is regenerated by heating at elevated temperature for a short time period.
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: April 3, 2007
    Assignee: Ford Global Technologies, LLC
    Inventors: Amy Berris, Jun Li, Mohinder Singh Chattha, William Lewis Henderson Watkins
  • Publication number: 20070068666
    Abstract: A spreader plate for an electronic component cooling assembly has a flat lower surface and a substantially arcuate upper surface of larger surface area than the lower surface which is generally convex and arcuate in cross section, and which decreases in thickness, as measured between the lower and upper surfaces, moving from the central area out to the periphery. This allows the heat flux lines to be more evenly spaced and regular in length, as compared to a typical plate with flat upper and lower surfaces of equal surface area.
    Type: Application
    Filed: September 27, 2005
    Publication date: March 29, 2007
    Inventor: Mohinder Singh Bhatti
  • Patent number: 7174722
    Abstract: The invention provides a heat exchanger operable, for example, with Stirling cooling system. The heat exchanger includes a first member having an inner surface defining a flow path for a working fluid. The first member also includes an outer surface spaced from the inner surface. The heat exchanger also includes a second member cooperating with the first member to define a first substantially enclosed heat exchanging chamber having a height and extending along at least a portion of the outer surface. The heat exchanger also includes at least one first blind conduit including an opening communicating with the first substantially enclosed heat exchanging chamber and a distal end spaced from the opening. The second member and the at least one first blind conduit cooperate with one another to define an enclosed path for a two-phase fluid to move along back and forth between the outer surface and the distal end.
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: February 13, 2007
    Assignee: Delphi Technologies, Inc.
    Inventor: Mohinder Singh Bhatti
  • Patent number: 7143816
    Abstract: A heat sink for an electrical device is distinguished by a confining plate extending parallel to and along each lateral side of fins and extending upwardly from a top surface of a base to a bottom surface of a lid to define an outlet-chamber extending from the outer ends of the fins and outside of the fins back toward a vertical nozzle. A cylindrical outlet is disposed on the inlet axis outwardly of each of the confining plates for directing fluid flow on each side of the fins. The outer wall presents a pair of oppositely facing apexes and the outer wall curves outwardly from each apex in opposite directions in a generally heart-shape around and spaced from the fins and back into the outlets to define the outlet-chambers which increase in volume from the ends of the fins back toward the outlets to reduce the fluid pressure.
    Type: Grant
    Filed: September 9, 2005
    Date of Patent: December 5, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Debashis Ghosh, Mohinder Singh Bhatti, Ilya Reyzin, Mark Joseph Parisi
  • Patent number: 7119434
    Abstract: A CPU cooling assembly having a first, covering layer of conductive material above the upper surface of an enclosed, heat producing chip and a third, upper layer of conductive material (a heat sink base plate) thermally bonded to the first by an intermediate, second layer of thin, conforming material (thermal grease) that is far less thermally conductive, and more resistive, than the other two layers. The relative thickness relationship of the first and third, more conductive, layers is essentially reversed from the prior art, with first layer being relatively thicker than the third. This creates an overall lower resistance for the three layer sandwich.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: October 10, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Debashis Ghosh, Mohinder Singh Bhatti, Ilya Reyzin