Abstract: A high speed, phase shifting scanning profilometry system is disclosed. A high speed CMOS sensor having more than 3 rows of pixels, in one embodiment having 1024, each row of which being randomly accessible, is positioned above a workpiece movable below the camera. The workpiece is illuminated in a non-uniform manner by an illumination source configured to project a predetermined pattern or gradient of light. As the workpiece is moved under the sensor, selected rows of pixels register the non-uniform light reflected from the workpiece and provide the data to a computer for calculating a surface profile for that row.

Abstract: A method for 3 dimensional scanning using a light source for projecting a source of illumination configured to be non-uniform or having a predetermined pattern is disclosed. A CMOS sensor having randomly accessible rows of pixels, and an associated lens system, is mounted above a workpiece, with the workpiece and sensor movable with respect to each other in a scanning relation. Rows of pixels of the sensor are selected for registering reflected light, with data from the selected rows provided to a computer for calculating height information of features of the workpiece. Significantly, both 2 dimensional and 3 dimensional images may be generated during a single scanning pass because of the non-uniform source of light and random access capabilities of the sensor.

Abstract: A machine vision system (1) has two laser sources (2, 3) to illuminate a solder deposit from both sides for comprehensive coverage without occlusion. The camera (4) has an FGPA (32) programmed to define a subset of the sensor array (20) as a region of interest to be processed for each laser source (2, 3). This reduces the amount of data transfer and processing required. The image line (31) is dynamically maintained in the region of interest by adjustement of camara Z position according to warp of the substrate (S).

Abstract: An apparatus in one example comprises a computer component that receives one or more images of one or more packaging materials from one or more imaging components. The computer component employs an analysis of the one or more images to make a determination of a package integrity of the one or more packaging materials.

Abstract: An apparatus in one example comprises a computer component that receives one or more images of one or more packaging materials from one or more imaging components. The computer component employs an analysis of the one or more images to make a determination of a package integrity of the one or more packaging materials.

Abstract: A machine vision system (1) has two laser sources (2, 3) to illuminate a solder deposit from both sides for comprehensive coverage without occlusion. The camera (4) has an FGPA (32) programmed to define a subset of the sensor array (20) as a region of interest to be processed for each laser source (2, 3). This reduces the amount of data transfer and processing required. The image line (31) is dynamically maintained in the region of interest by adjustement of camara Z position according to warp of the substrate (S).