Abstract: In order to enable applications such as artificial intelligence (AI) and machine learning in a large scale, a large amount of information needs to be processed very fast. To improve the speed of the computation, not only faster graphical and central processors are required, but also the communication between processors and high bandwidth memories should be fast enough to reduce the latency. Optical interconnect can be a replacement for copper interconnect which is providing larger bandwidth and lower latency. As an efficient light source, micro-LEDs can be used as light source for chip-to-chip optical interconnect. Using a massively parallel memory-processor interconnect using low-power micro-LED, the computation speed will increase dramatically, and less amount of energy will be wasted through copper self-heating.

Abstract: Selective bonding integrates semiconductor devices onto a receiver substrate. A laser releases devices from a substrate according to a pattern. The pattern syncs laser frequency and speed/location of the stage with the receiver substrate, or uses a diffractive optical element and pottering, or masks the emitted laser to a desired size/shape. Laser steering employs digital micromirror devices or fast scanning mirrors followed by an f-theta lens. Sequential selective bonding and laser processing enables full-colour display by transferring violet or blue micro-LEDs and employing colour-conversion layers or sequentially patterning red, green, and blue sub-pixels. The same method transfers driving circuits onto a substrate. A pattern from defective devices is generated after test and used for repair. A second round prints micro-devices onto pads in or beside defective devices.

Abstract: An electronic circuit for thin-film transistors, the circuit including: a driving TFT; an input signal; a compensation TFT provided between gate and source terminals of the driving TFT; a storage TFT provided between the input signal and the gate of the driving TFT; a plurality of switching TFTs configured to charge the storage TFT from the input signal in one cycle and then charge the compensation TFT from the storage TFT during another cycle, such that the compensation TFT compensates for degradation of the driving TFT. An opto-electronic fabrication method including: forming an opto-electronic device on a growth substrate; temporarily bonding the opto-electronic device to a carrier substrate; removal of the growth substrate; etching the opto-electronic device to a predetermined height; coating the opto-electronic device with a functional metal layer; bonding the opto-electronic device onto a final receiver substrate; and removing the carrier substrate.