Patents by Inventor Mohsen F. Rad

Mohsen F. Rad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low cost solution for 2.5D and 3D packaging using USR chiplets
    Patent number: 11855056
    Abstract: Systems and methods are provided for a system in a package (SiP) connectivity using one or more ultra short reach (USR) chiplets. The USR chiplet can receive/transmit data at a lower throughput and transmit/receive that data at a higher throughput over ultra short distances. The USR chiplet can be connected to a main integrated circuit (IC) using a high density interconnect or integrated with the main IC in a mold material. The USR chip can enable the main IC to transfer data over a substrate at a higher speed using a fewer number of traces.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: December 26, 2023
    Assignee: Eliyan Corporation
    Inventor: Mohsen F. Rad