Patents by Inventor Mohsen Mardi

Mohsen Mardi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for preventing probe card oxidation
    Patent number: 8269518
    Abstract: A method and apparatus for a pre-biasing storage mechanism to prevent oxidation and other contaminants from forming on the probe tips and probe tails of a probe card. The pre-biasing storage mechanism imposes a positive bias on the probe needles of the probe card so as to create physical contact between the probe tails and the conductive pads of the printed circuit board (PCB) arrangement of the probe card during a disengaged state of the probe card. In addition, the storage mechanism imposes a positive bias on the probe needles of the probe card, so as to create physical contact between the probe tips and a probe tip cleaning pad, or other protective surface, during a disengaged state of the probe card.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: September 18, 2012
    Assignee: Xilinx, Inc.
    Inventors: Elvin P. Dang, Mohsen Mardi
  • Semiconductor component having test pads and method and apparatus for testing same
    Publication number: 20070221920
    Abstract: A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.
    Type: Application
    Filed: May 17, 2007
    Publication date: September 27, 2007
    Applicant: Xilinx, Inc.
    Inventors: Mohsen Mardi, Jae Cho, Xin Wu, Chih-Chung Wu, Shih-Liang Liang, Sanjiv Stokes, Hassan Bazargan
  • Semiconductor component having test pads and method and apparatus for testing same
    Publication number: 20070218573
    Abstract: A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.
    Type: Application
    Filed: May 17, 2007
    Publication date: September 20, 2007
    Applicant: Xilinx, Inc.
    Inventors: Mohsen Mardi, Jae Cho, Xin Wu, Chih-Chung Wu, Shih-Liang Liang, Sanjiv Stokes, Hassan Bazargan