Patents by Inventor Mohyeddin S. Majd

Mohyeddin S. Majd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reflow and wave soldering techniques for bottom side components
    Patent number: 5155904
    Abstract: A soldering method is provided which includes applying a solder paste onto a pad for a surface-mount component on a bottom side of a printed circuit board, applying an adhesive to a surface-mount component receiving site on the bottom side of the board, placing a surface-mount component on the bottom side so as to contact the solder paste and adhesive, and reflowing the solder while curing the applied adhesive to affix the surface-mount component to the bottom side of the board. This method also includes disposing a through-hole component on the top side of the board and mass soldering the bottom side of the printed circuit board to join the through-hole component to the board.
    Type: Grant
    Filed: April 3, 1991
    Date of Patent: October 20, 1992
    Assignee: Compaq Computer Corporation
    Inventor: Mohyeddin S. Majd