Patents by Inventor Moin Ahmad

Moin Ahmad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire-lead through hole interconnect device
    Patent number: 5455741
    Abstract: An electronic device comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity in a first surface and a plurality of lead through holes with inlet guides extending from the cavity to a second surface having a circuit thereon, an electronic element mounted in the cavity and having a plurality of leads, a plurality of the leads extending via the through holes from the element to the second surface, and a plurality of lead terminal recesses formed at the second surface for for receiving and forming terminal ends and connections of the leads to the circuit on the second surface.
    Type: Grant
    Filed: October 26, 1993
    Date of Patent: October 3, 1995
    Assignee: Pulse Engineering, Inc.
    Inventors: Ka K. Wai, Moin Ahmad, Aurelio J. Gutierrez, James D. Lint