Abstract: A clip assembly can be coupled to a vehicle floor mat where the clip assembly includes a top member having a cover, a gasket, first opposing body portions, an attachment member, and a first body. The clip assembly can additionally include a bottom member having a bezel, second opposing body portions, and a second body. The top member and the bottom member can be positioned and/or coupled in the vehicle floor mat with the attachment member coupled in the bezel.

Abstract: An apparatus is provided for holding an electronic device. That apparatus includes a telescoping ball joint support and a cradle carried on the telescoping ball joint support. The apparatus is displaceable between a stowed configuration and a deployed configuration. A related method of holding an electronic device adjacent a panel of a motor vehicle is also disclosed.

Abstract: An apparatus is provided for holding an electronic device. That apparatus includes a telescoping ball joint support and a cradle carried on the telescoping ball joint support. The apparatus is displaceable between a stowed configuration and a deployed configuration. A related method of holding an electronic device adjacent a panel of a motor vehicle is also disclosed.

Abstract: A clip assembly can be coupled to a vehicle floor mat where the clip assembly includes a top member having a cover, a gasket, first opposing body portions, an attachment member, and a first body. The clip assembly can additionally include a bottom member having a bezel, second opposing body portions, and a second body. The top member and the bottom member can be positioned and/or coupled in the vehicle floor mat with the attachment member coupled in the bezel.

Abstract: Described herein is for a system and procedure to apply vaporization for heat transfer processes, particularly condensers in air conditioning and refrigeration systems both for upgrading units using the discontinued R22 refrigerant and for new equipments. The application can be applied to other cooling processes such as computer chip cooling, garments for medical, personal garments for military personnel. The application points to the features of different manifestations of vaporization for cooling in both natural and other equipments. The process can be extended for small and compact implementation on new equipments with maintenance improvement compared to water tower coolers, lower capitalization costs, modularity and ease of maintenance, and indoor installations enabling extension of capability of the cooling system with application of air flow condition.