Abstract: A blending appliance is provided including a motorized base, a blending container, and a blade assembly fitted into an opening of the blending container and rotatably coupled to the motorized base when the blending container is mounted on the motorized base. The blade assembly includes a lower blade element disposed on a spindle performing blending operations on ingredients at a lower end of the blending container; and an upper working element disposed on a shaft spaced apart from the lower blade element, and including an upper working portion and a lower working portion spaced apart from the upper working portion. The upper working portion acting to reduce cavitation in the lower blades element during the blending process.

Abstract: There is provided an appliance including a base having a housing, a motor-fan assembly disposed in the housing, a working implement which is operated by the motor-fan assembly when energized, a pocket integrally formed in a sidewall of the housing configured for use as a carrying handle, and one or more apertures formed in the pocket configured to allow cooling air to enter the housing to cool the motor-fan assembly.

Abstract: The is provided an appliance including a food preparation container, an agitator assembly for attachment to a blending container, the agitator assembly including: an agitator nut configured to secure the agitator assembly to the blending container, an agitator base including at least one agitator blade mounted thereon and configured to be seated in the agitator nut prior to the agitator assembly being secured to the blending container, a groove formed in an inner wall of the agitator nut, and a seal having an outer periphery that when inserted into the groove secures the agitator base into the agitator nut.

Abstract: A blending appliance is provided including a motorized base, a blending container, and a blade assembly fitted into an opening of the blending container and rotatably coupled to the motorized base when the blending container is mounted on the motorized base. The blade assembly includes a lower blade element disposed on a spindle performing blending operations on ingredients at a lower end of the blending container; and an upper working element disposed on a shaft spaced apart from the lower blade element, and including an upper working portion and a lower working portion spaced apart from the upper working portion. The upper working portion acting to reduce cavitation in the lower blades element during the blending process.

Abstract: A blending appliance is provided including a motorized base, a blending container, and an agitator configuration fitted into an opening of the blending container and rotatably coupled to the motorized base when the blending container is mounted on the motorized base. The agitator configuration includes a blade arrangement disposed on a spindle performing a blending operation on ingredients at a lower end of the blending container and a whisk including a plurality of loops disposed a pre-determined distance from the blade arrangement at a distal end of a rotating shaft interconnected to the spindle.

Abstract: There is provided an appliance including a base having a housing, a motor-fan assembly disposed in the housing, a working implement which is operated by the motor-fan assembly when energized, a pocket integrally formed in a sidewall of the housing configured for use as a carrying handle, and one or more apertures formed in the pocket configured to allow cooling air to enter the housing to cool the motor-fan assembly.

Abstract: A blade assembly suited for both blending and food processing in small throat blender jars is provided. The blade assembly comprises a plurality of blade forms each designed to perform a specific blending or processing task while simultaneously working together and with the geometric restrictions of the jar to optimize the assembly's capability to crush ice, blend or mix liquids and/or semi-solid materials, and to chop, cut, or slice solid food items without the need for user interaction to clear compacted items from the blades and/or the walls or bottom of the jar during its operation. The improved performance also serves the beneficial side effect of improved bearing and motor life in the blender/food processor.

Abstract: A blade assembly suited for both blending and food processing in small throat blender jars is provided. The blade assembly comprises a plurality of blade forms each designed to perform a specific blending or processing task while simultaneously working together and with the geometric restrictions of the jar to optimize the assembly's capability to crush ice, blend or mix liquids and/or semi-solid materials, and to chop, cut, or slice solid food items without the need for user interaction to clear compacted items from the blades and/or the walls or bottom of the jar during its operation. The improved performance also serves the beneficial side effect of improved bearing and motor life in the blender/food processor.

Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

Abstract: A cooling system for a semiconductor die carrier is disclosed that includes a cooling fan disposed at a substantial distance from a semiconductor die carrier, a cooling duct including an inlet portion and an outlet portion, and a heat exchanger disposed on an upper surface of the semiconductor die carrier. The cooling duct inlet portion is attached to the cooling fan and the cooling duct outlet portion is disposed in close proximity to the heat exchanger. The cooling fan draws ambient air into the cooling duct and the ambient air exits the cooling duct outlet portion and passes in a heat exchange relationship with the heat exchanger.

Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

Abstract: A computer system includes a bus system; a pluggable central processing unit circuit board, coupled to the bus system; a pluggable logic board coupled to the pluggable central processing unit circuit board through the bus system; a pluggable input/output board coupled to the pluggable logic board through the bus system; a first connector unit for directly connecting the pluggable central processing unit circuit board to a first predetermined location on the pluggable logic board; and a second connector unit for directly connecting the pluggable logic board to a predetermined location on the pluggable input/output board.

Abstract: Disclosed is a decorative panel for attachment to the exterior of a computer enclosure including a fastener receiving portion for facilitating attachment of the decorative panel to an outer surface of the computer enclosure, a plurality of irregular geometric shaped surface depressions on a first surface of the decorative panel fixed in an ornamental arrangement, and at least one bore which extends completely through the decorative panel adapted to allow air to flow through the decorative panel and into an interior of the computer enclosure.