Abstract: A sensor and method for use in measuring a physical characteristic of a fluid in a microfluidic system is provided. A microfluidic chip has a thin deformable membrane that separates a microfluidic channel from a microwave resonator sensor. The membrane is deformable in response to loading from interaction of the membrane with the fluid. Loading may be fluid pressure in the channel, or shear stress or surface stress resulting from interaction of the membrane with the fluid. The deformation of the membrane changes the permittivity in the region proximate the sensor. A change in permittivity causes a change in the electrical parameters of the sensor, thereby allowing for a characteristic of the fluid, such as flow rate, or a biological or chemical characteristic, to be measured. Also, a microwave sensor with improved sensitivity for characterizing a fluid in a microfluidic channel is provided.

Abstract: A sensor and method for use in measuring a physical characteristic of a fluid in a microfluidic system is provided. A microfluidic chip has a thin deformable membrane that separates a microfluidic channel from a microwave resonator sensor. The membrane is deformable in response to loading from interaction of the membrane with the fluid. Loading may be fluid pressure in the channel, or shear stress or surface stress resulting from interaction of the membrane with the fluid. The deformation of the membrane changes the permittivity in the region proximate the sensor. A change in permittivity causes a change in the electrical parameters of the sensor, thereby allowing for a characteristic of the fluid, such as flow rate, or a biological or chemical characteristic, to be measured. Also, a microwave sensor with improved sensitivity for characterizing a fluid in a microfluidic channel is provided.

Abstract: A system and method for monitoring condition of a vessel coating layer and detecting compromise of the coating and its causes are provided. The system includes a sensor positioned on a coating layer of the vessel, and a reader for reading a resonant behavior of the sensor. The method includes positioning an array of a plurality of sensors on the coating layer, reading a resonant frequency of each sensor using the reader, and monitoring the resonant frequency of the sensors for a variation in the resonant frequency of at least one sensor, the variation in the resonant frequency of the at least one sensor indicating a change in the condition of the coating layer. Variations in the resonant frequency being indicative of breaches such as water penetration, air penetration, corrosion, stress, strain, and cracking. Thus, proactive prediction of a cause and location of coating breaches is accomplished.

Abstract: Apparatuses and methods for non-contact sensing of physical or chemical properties of a target sample using a planar microwave resonator are provided. In one aspect, a planar microwave resonator is used in combination with an active feedback loop for increasing the quality factor of the resonator to compensate for an existing signal loss in the sample or environment. In another aspect, an active feedback loop is used in combination with a microwave resonator to compensate for signal loss in a lossy medium. In another aspect, a planar microwave resonator comprising a secondary layer defining a sensing interface may be used to facilitate the sensing by exposing the secondary layer to a substance to be investigated. In another aspect, a planar microwave resonator sensor is provided comprising separate resonator and active feedback loop components that are indirectly connected through an electromagnetically coupling and may be constructed on two separate support structure.

Abstract: Apparatuses and methods for non-contact sensing of physical or chemical properties of a target sample using a planar microwave resonator are provided. In one aspect, a planar microwave resonator is used in combination with an active feedback loop for increasing the quality factor of the resonator to compensate for an existing signal loss in the sample or environment. In another aspect, an active feedback loop is used in combination with a microwave resonator to compensate for signal loss in a lossy medium. In another aspect, a planar microwave resonator comprising a secondary layer defining a sensing interface may be used to facilitate the sensing by exposing the secondary layer to a substance to be investigated. In another aspect, a planar microwave resonator sensor is provided comprising separate resonator and active feedback loop components that are indirectly connected through an electromagnetically coupling and may be constructed on two separate support structure.

Abstract: Apparatuses and methods for non-contact sensing of physical or chemical properties of a target sample using a planar microwave resonator are provided. In one aspect, a planar microwave resonator is used in combination with an active feedback loop for increasing the quality factor of the resonator to compensate for an existing signal loss in the sample or environment. In another aspect, an active feedback loop is used in combination with a microwave resonator to compensate for signal loss in a lossy medium. In another aspect, a planar microwave resonator comprising a secondary layer defining a sensing interface may be used to facilitate the sensing by exposing the secondary layer to a substance to be investigated. In another aspect, a planar microwave resonator sensor is provided comprising separate resonator and active feedback loop components that are indirectly connected through an electromagnetically coupling and may be constructed on two separate support structure.

Abstract: There is disclosed a method of heating a wafer for bonding, the method comprising adding a patterned susceptor close to a wafer interface, and applying microwave energy to the patterned susceptor. There is also disclosed an electrically conductive film, in direct contact with a relatively non-conductive substrate (preferably a thermoplastic) and made of individual electrically isolated elements (features) with a maximum dimension less than ¼ the wavelength used in the microwave, and minimum dimension greater than 100 um in the plane of the film. The film and substrate is selectively heated by resistive loss caused by dissipated energy from microwave radiation.

Abstract: A multi-port RF MEMS switch, a switch matrix having several multi-port RF MEMS switches and an interconnect network have a monolithic structure with clamped-clamped beams, cantilever beams or thermally operated actuators. A method of fabricating a monolithic switch has clamped-clamped beams or cantilever beams.

Abstract: A three dimensional waveguide is integrated with a MEMS structure to control a signal in various RF components. The components include switches, variable capacitors, filters and phase shifters. A controller controls movement of the MEMS structure to control a signal within the component. A method of construction and a method of operation of the component are described. The switches have high power handling capability and can be operated at high frequencies. By integrating a three dimensional waveguide with a MEMS structure, the components can be small in size with good operating characteristics.

Abstract: A multi-port RF MEMS switch, a switch matrix having several multi-port RF MEMS switches and an interconnect network have a monolithic structure with clamped-clamped beams, cantilever beams or thermally operated actuators. A method of fabricating a monolithic switch has clamped-clamped beams or cantilever beams.

Abstract: A three dimensional waveguide is integrated with a MEMS structure to control a signal in various RF components. The components include switches, variable capacitors, filters and phase shifters. A controller controls movement of the MEMS structure to control a signal within the component. A method of construction and a method of operation of the component are described. The switches have high power handling capability and can be operated at high frequencies. By integrating a three dimensional waveguide with a MEMS structure, the components can be small in size with good operating characteristics.

Abstract: A three dimensional waveguide is integrated with a MEMS structure to control a signal in various RF components. The components include switches, variable capacitors, filters and phase shifters. A controller controls movement of the MEMS structure to control a signal within the component. A method of construction and a method of operation of the component are described. The switches have high power handling capability and can be operated at high frequencies. By integrating a three dimensional waveguide with a MEMS structure, the components can be small in size with good operating characteristics.