Patents by Inventor Mokshith TEJASVI

Mokshith TEJASVI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Containing electromagnetic interference radiation in lidless semiconductor packages
    Patent number: 11894316
    Abstract: A semiconductor package may include a substrate, an application-specific integrated circuit (ASIC) provided on a first portion of a surface of the substrate, a memory device provided on a second portion of the surface of the substrate, and a stiffener plate provided on a third portion of the surface of the substrate. The stiffener plate may be spaced from and may surround the ASIC and the memory device. The semiconductor package may include an electromagnetic interference (EMI) absorber provided on a fourth portion of the surface of the substrate. The EMI absorber may be provided between the stiffener plate and the ASIC and the memory device. The EMI absorber may surround the ASIC and the memory device and may block EMI radiation generated by the ASCI and the memory device.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: February 6, 2024
    Assignee: Juniper Networks, Inc.
    Inventors: Mokshith Tejasvi, Saravanan Govindasamy, Girish Muddenahalli Haleshappa, Raveen Jagadeesan
  • CONTAINING ELECTROMAGNETIC INTERFERENCE RADIATION IN LIDLESS SEMICONDUCTOR PACKAGES
    Publication number: 20230187375
    Abstract: A semiconductor package may include a substrate, an application-specific integrated circuit (ASIC) provided on a first portion of a surface of the substrate, a memory device provided on a second portion of the surface of the substrate, and a stiffener plate provided on a third portion of the surface of the substrate. The stiffener plate may be spaced from and may surround the ASIC and the memory device. The semiconductor package may include an electromagnetic interference (EMI) absorber provided on a fourth portion of the surface of the substrate. The EMI absorber may be provided between the stiffener plate and the ASIC and the memory device. The EMI absorber may surround the ASIC and the memory device and may block EMI radiation generated by the ASCI and the memory device.
    Type: Application
    Filed: December 13, 2021
    Publication date: June 15, 2023
    Inventors: Mokshith TEJASVI, Saravanan GOVINDASAMY, Girish Muddenahalli HALESHAPPA, Raveen JAGADEESAN