Abstract: A sputtering device includes a reaction chamber, a pin mechanism, and a microwave heating mechanism. The reaction chamber includes a base configured to carry a workpiece. The pin mechanism is arranged in the reaction chamber. The pin mechanism generates a relative ascending and descending motion with the base and lifts the workpiece from the base. The microwave heating mechanism is arranged in the reaction chamber and includes a microwave transmitter and a mobile device. The mobile device is connected to the microwave transmitter and configured to move the microwave transmitter to a position under the workpiece in response to the workpiece being carried by the pin mechanism to cause the microwave transmitter to emit microwaves to the workpiece to heat the workpiece.

Abstract: A technology of 3D printing integration of hard materials and cells, a preparation of bone-repair functional module with osteogenic microenvironment, bone organoid method and the application of quick repair of bone defects are provided. A preparation method of biological microenvironmental factors as independent osteogenic factors is further provided. The present integrated 3D printing technology realizes 3D printing of cells and hard materials synchronously by adjusting the temperature, so as to build a real sense of biomimetic bone tissue, which can be customized according to the specific defects and clinical needs of patients.

Abstract: A sputtering device includes a reaction chamber, a thimble mechanism, and a microwave heating mechanism. The reaction chamber includes a base configured to carry a workpiece. The thimble mechanism is arranged in the reaction chamber. The thimble mechanism generates a relative ascending and descending motion with the base and lifts the workpiece from the base. The microwave heating mechanism is arranged in the reaction chamber and includes a microwave transmitter and a mobile device. The mobile device is connected to the microwave transmitter and configured to move the microwave transmitter to a position under the workpiece in response to the workpiece being carried by the thimble mechanism to cause the microwave transmitter to emit microwaves to the workpiece to heat the workpiece.