Patents by Inventor Momchil T. MIHNEV

Momchil T. MIHNEV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate cavity
    Patent number: 10268055
    Abstract: A method for making an apparatus, a system, and apparatus, the apparatus and system each comprising a substrate with a top side, wherein the substrate has a set of cavities in the top side of the substrate, wherein the substrate has a set of conductive elements on the top side of the substrate arranged to electrically couple with a set of conductive elements of a photonic integrated circuit (PIC), wherein each cavity of the set of cavities when coupled to the PIC creates a surface tension when exposed to an underfill to cause the underfill to flow around each cavity.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: April 23, 2019
    Assignee: Acacia Communications, Inc.
    Inventors: Christopher Doerr, Long Chen, John Heanue, Momchil T. Mihnev
  • Substrate cavity
    Patent number: 10209539
    Abstract: A method for making an apparatus, a system, and apparatus, the apparatus and system each comprising a substrate with a top side, wherein the substrate has a set of cavities in the top side of the substrate, wherein the substrate has a set of conductive elements on the top side of the substrate arranged to electrically couple with a set of conductive elements of a photonic integrated circuit (PIC), wherein each cavity of the set of cavities when coupled to the PIC creates a surface tension when exposed to an underfill to cause the underfill to flow around each cavity.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: February 19, 2019
    Assignee: Acacia Communications, Inc.
    Inventors: Christopher Doerr, Long Chen, John Heanue, Momchil T. Mihnev
  • Patterning by stamped metal resist
    Patent number: 9793481
    Abstract: A method is provided. A first layer is provided over a substrate, the first layer comprising a first material. A patterned second layer is applied over the first layer via stamping. The second layer comprising a second material. The second layer covers a first portion of the first layer, and does not cover a second portion of the first layer. The second portion of the first layer is removed via a subtractive process while the first portion of the first layer is protected from removal by the patterned second layer.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: October 17, 2017
    Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
    Inventors: Stephen R. Forrest, Momchil T. Mihnev, Andre D. Taylor, Xin Xu
  • PATTERNING BY STAMPED METAL RESIST
    Publication number: 20100080914
    Abstract: A method is provided. A first layer is provided over a substrate, the first layer comprising a first material. A patterned second layer is applied over the first layer via stamping. The second layer comprising a second material. The second layer covers a first portion of the first layer, and does not cover a second portion of the first layer. The second portion of the first layer is removed via a subtractive process while the first portion of the first layer is protected from removal by the patterned second layer.
    Type: Application
    Filed: December 9, 2008
    Publication date: April 1, 2010
    Applicant: The Regents of the University of Michigan
    Inventors: Stephen R. FORREST, Momchil T. MIHNEV, Andre D. TAYLOR, Xin XU