Abstract: A chip fabricating process with the following steps is provided. Firstly, an under ball metal (UBM) layer is formed on a plurality of bump pads and wire pads of a wafer. Then, a portion of the thickness of the UBM layer on the wire pads is removed so as to form a metal lining on the wire pads. Then, a bump is formed on the UBM layer of each bump pad. At last, the wafer is cut into a plurality of chip structures, and each chip structure includes a portion of the bump pads and the wire pads. Therefore, the present invention can fabricate the chip structure with two kinds of pads. Moreover, the present invention also discloses a chip structure and a wafer structure.

Abstract: A test key for bridging and continuity testing is provided, comprising at least one test unit, which is composed of a first strand and a second strand embedded or non-touching intertwined with each other. The strand comprising a closed hook, a corresponding extension and a corresponding connection. The corresponding connections are electrically connected to an external voltage by at least one test pad, wherein the closed hook of the first strand is parallel with the closed hook of the second strand. A first corner is formed between the closed hooks and the corresponding extension, causing the closed hook of the first strands to be adjacent and parallel with the closed hook and the extension of the second strand. Moreover, another corner is formed between the extension and the corresponding connection, causing the connection of the first strand to be adjacent and parallel with the extension of second strand, forming an intertwining pattern.