Patents by Inventor Mong Hu

Mong Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interlocking clip heatsink mounting system
    Patent number: 9146062
    Abstract: An interlocking clip heatsink mounting system (10) is provided for securing a heatsink (12) in optimal thermal contact with a chip carrier (14). The clip structure (24) includes a pair of identical interlocking clip members (28) and a spring member (26). The clip side members (28) are provided with crenellations (50) and hook wedges (62) so as to interlock in partially engaged and fully engaged modes.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: September 29, 2015
    Assignee: Radian Thermal Products, Inc.
    Inventors: Thierry Sin Yan Too, Mong Hu
  • INTERLOCKING CLIP HEATSINK MOUNTING SYSTEM
    Publication number: 20140248081
    Abstract: An interlocking clip heatsink mounting system (10) is provided for securing a heatsink (12) in optimal thermal contact with a chip carrier (14). The clip structure (24) includes a pair of identical interlocking clip members (28) and a spring member (26). The clip side members (28) are provided with crenellations (50) and hook wedges (62) so as to interlock in partially engaged and fully engaged modes.
    Type: Application
    Filed: March 1, 2013
    Publication date: September 4, 2014
    Applicant: Radian Thermal Products, Inc.
    Inventors: Thierry Sin Yan TOO, Mong HU
  • Heatsink mounting system
    Patent number: 8274793
    Abstract: A heatsink mounting system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) is includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) with curved handle posts (39) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: September 25, 2012
    Assignee: Intricast Company, Inc.
    Inventors: Fang Wang, Thierry Sin Yan Too, Jim Moore, Mong Hu
  • HEATSINK MOUNTING SYSTEM
    Publication number: 20100321894
    Abstract: A heatsink mounting system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) is includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) with curved handle posts (39) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
    Type: Application
    Filed: August 27, 2010
    Publication date: December 23, 2010
    Applicant: INTRICAST COMPANY, INC.
    Inventors: Fang Wang, Thierry Sin Yan Too, Jim Moore, Mong Hu
  • Heatsink mounting system
    Patent number: 7848107
    Abstract: A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: December 7, 2010
    Assignee: Intricast Company, Inc.
    Inventors: Fang Wang, Thierry Sin Yan Too, Jim Moore, Mong Hu
  • HEATSINK MOUNTING SYSTEM
    Publication number: 20100157539
    Abstract: A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.
    Type: Application
    Filed: December 23, 2008
    Publication date: June 24, 2010
    Applicant: INTRICAST COMPANY, INC.
    Inventors: Fang Wang, Thierry Sin Yan Too, Jim Moore, Mong Hu