Patents by Inventor Mong Hyun Cho

Mong Hyun Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10960498
    Abstract: A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core includes: (a) pure silver consisting of silver and further components; or (b) doped silver consisting of silver, at least one doping element, and further components; or (c) a silver alloy consisting of silver, palladium and further components; or (d) a silver alloy consisting of silver, palladium, gold, and further components; or (e) a doped silver alloy consisting of silver, palladium, gold, at least one doping element, and further components, wherein the individual amount of any further component is less than 30 wt.-ppm and the individual amount of any doping element is at least 30 wt.-ppm, and the coating layer is a single-layer of gold or palladium or a double-layer comprised of an inner layer of nickel or palladium and an adjacent outer layer of gold.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: March 30, 2021
    Assignees: HERAEUS MATERIALS SINGAPORE PTE., LTD., HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Il Tae Kang, Yong-Deok Tark, Mong Hyun Cho, Jong Su Kim, Hyun Seok Jung, Tae Yeop Kim, Xi Zhang, Murali Sarangapani
  • Publication number: 20180345421
    Abstract: A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core includes: (a) pure silver consisting of silver and further components; or (b) doped silver consisting of silver, at least one doping element, and further components; or (c) a silver alloy consisting of silver, palladium and further components; or (d) a silver alloy consisting of silver, palladium, gold, and further components; or (e) a doped silver alloy consisting of silver, palladium, gold, at least one doping element, and further components, wherein the individual amount of any further component is less than 30 wt.-ppm and the individual amount of any doping element is at least 30 wt.-ppm, and the coating layer is a single-layer of gold or palladium or a double-layer comprised of an inner layer of nickel or palladium and an adjacent outer layer of gold.
    Type: Application
    Filed: September 16, 2016
    Publication date: December 6, 2018
    Applicants: Heraeus Materials Singapore Pte., Ltd., Heraeus Oriental HiTec Co., Ltd.
    Inventors: Il Tae Kang, Yong-Deok Tark, Mong Hyun Cho, Jong Su Kim, Hyun Seok Jung, Tae Yeop Kim, Xi Zhang, Murali Sarangapani