Patents by Inventor Mong-Na Lo Huang

Mong-Na Lo Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and electronic device for configuring signal pads between three-dimensional stacked chips
    Patent number: 11748545
    Abstract: A method and an electronic device for configuring signal pads between three-dimensional stacked chips are provided. The method includes: obtaining a plurality of frequency response curves corresponding to a plurality of parameter sets; obtaining an operating frequency; selecting a selected frequency response curve from the plurality of frequency response curves according to the operating frequency, where the selected frequency response curve corresponds to a selected parameter set among the plurality of parameter sets; generating, according to the selected parameter set, a signal pad configuration for configuring a first signal pad and a second signal pad on a surface of a chip; and outputting the signal pad configuration.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: September 5, 2023
    Assignee: I-SHOU UNIVERSITY
    Inventors: Yu-Jung Huang, Mong-Na Lo Huang, Tzu-Lun Yuan, Mei-Hui Guo
  • METHOD AND ELECTRONIC DEVICE FOR CONFIGURING SIGNAL PADS BETWEEN THREE-DIMENSIONAL STACKED CHIPS
    Publication number: 20230038144
    Abstract: A method and an electronic device for configuring signal pads between three-dimensional stacked chips are provided. The method includes: obtaining a plurality of frequency response curves corresponding to a plurality of parameter sets; obtaining an operating frequency; selecting a selected frequency response curve from the plurality of frequency response curves according to the operating frequency, where the selected frequency response curve corresponds to a selected parameter set among the plurality of parameter sets; generating, according to the selected parameter set, a signal pad configuration for configuring a first signal pad and a second signal pad on a surface of a chip; and outputting the signal pad configuration.
    Type: Application
    Filed: August 27, 2021
    Publication date: February 9, 2023
    Applicant: I-SHOU UNIVERSITY
    Inventors: Yu-Jung Huang, Mong-Na Lo Huang, Tzu-Lun Yuan, Mei-Hui Guo