Patents by Inventor Mong Ryong Lee

Mong Ryong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of filling a via hole and apparatus for performing the same
    Patent number: 10777458
    Abstract: A method of filling a via hole and an apparatus for performing the same are disclosed. The method includes providing a filling material having a fluidity on a via hole formed in the substrate, forming an electric field through the substrate to fill the via hole with the filling material, and solidifying the filling material in the via hole. The apparatus includes a stage for supporting the substrate, upper and lower electrodes for forming the electric field, and a power supply connected with the upper and lower electrodes.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: September 15, 2020
    Assignee: SEMES CO., LTD.
    Inventors: Yoon Ki Sa, Mong Ryong Lee
  • Substrate treating apparatus and substrate treating method
    Patent number: 10711228
    Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a support member which supports a substrate; a treatment liquid discharging member which discharges a treatment liquid containing a monomeric substance to the substrate located in the support member; and a light irradiator which irradiates light to the treatment liquid discharged to the substrate.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: July 14, 2020
    Assignee: SEMES CO., LTD.
    Inventors: Mong-Ryong Lee, Miyoung Jo, Yerim Yeon, Anton Koriakin
  • JUICER THAT IS EASY TO MANUFACTURE AND IMPROVES PERFORMANCE
    Publication number: 20190167026
    Abstract: A juicer including: a driving part composed of a housing having a housing hollow part formed therein, and having a through-hole through which inner air is discharged at the position eccentric to one side in the width direction from the central portion formed on the bottom portion thereof, and a motor provided the housing hollow part by being surrounded by a motor housing; a juice part connected to the driving part to be driven to squeeze the juice; and a fastening part for detachably coupling the juice part to the driving part.
    Type: Application
    Filed: August 29, 2017
    Publication date: June 6, 2019
    Applicant: ANGEL CO., LTD.
    Inventors: Mun Hyun LEE, Chom Tu I KIM, Mong Ryong LEE, Jin Woo SON, Han Sung YANG, Jeong Su JANG, Seong-hwan PARK, Na Hyun KWON, Eun Hui JI, Min Ji KIM, Hye-Jung PARK
  • SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
    Publication number: 20190010430
    Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating method includes applying a treatment liquid containing a monomeric substance to a substrate that is intended to be cleaned, curing the treatment liquid with a cleaning film by irradiating light to the treatment liquid and polymerizing the monomeric substance, and removing the cleaning film.
    Type: Application
    Filed: July 6, 2018
    Publication date: January 10, 2019
    Inventors: MONG-RYONG LEE, MIYOUNG JO, YERIM YEON, ANTON KORIAKIN
  • METHOD OF FILLING A VIA HOLE AND APPARATUS FOR PERFORMING THE SAME
    Publication number: 20180182669
    Abstract: A method of filling a via hole and an apparatus for performing the same are disclosed. The method includes providing a filling material having a fluidity on a via hole formed in the substrate, forming an electric field through the substrate to fill the via hole with the filling material, and solidifying the filling material in the via hole. The apparatus includes a stage for supporting the substrate, upper and lower electrodes for forming the electric field, and a power supply connected with the upper and lower electrodes.
    Type: Application
    Filed: December 14, 2017
    Publication date: June 28, 2018
    Applicant: SEMES CO., LTD.
    Inventors: Yoon Ki SA, Mong Ryong Lee