Patents by Inventor Monica Lin

Monica Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IMPLANTS USING ULTRASONIC BACKSCATTER FOR SENSING ELECTRICAL IMPEDANCE OF TISSUE
    Publication number: 20230277057
    Abstract: Described herein is an implantable device configured to detect impedance characteristic of a tissue.
    Type: Application
    Filed: February 17, 2023
    Publication date: September 7, 2023
    Applicant: The Regents of the University of California
    Inventors: Michel M. Maharbiz, Jose M. Carmena, Dongjin Seo, Monica Lin, Meir Marmor, Safa Herfat, Chelsea Shields Bahney
  • Implants using ultrasonic backscatter for sensing electrical impedance of tissue
    Patent number: 11607128
    Abstract: Described herein is an implantable device configured to detect impedance characteristic of a tissue.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: March 21, 2023
    Assignee: The Regents of the University of California
    Inventors: Michel M. Maharbiz, Jose M. Carmena, Dongjin Seo, Monica Lin, Meir Marmor, Safa Herfat, Chelsea Shields Bahney
  • Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
    Patent number: 10653332
    Abstract: A device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical energy to the contact pads of the flexible printed circuit board.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: May 19, 2020
    Assignee: MC10, Inc.
    Inventors: Bryan McGrane, Milan Raj, PingHung Wei, Briana Morey, Roozbeh Ghaffari, Monica Lin, Jeffrey Model, Xianyan Wang, Bryan Keen, Stephen Lee
  • Methods and apparatus for monitoring wound healing using impedance spectroscopy
    Patent number: 10463293
    Abstract: Methods and apparatus for real-time, quantifiable monitoring of high-risk areas of biological tissue are described. The methods and apparatus use impedance spectroscopy to detect subtle changes in tissue health.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: November 5, 2019
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Michel Maharbiz, Vivek Subramanian, Ana Claudia Arias, Sarah Swisher, Amy Liao, Monica Lin, Felippe Pavinatto, Yasser Khan, Daniel Cohen, Elisabeth Leeflang, Shuvo Roy, Michael Harrison, David Young
  • IMPLANTS USING ULTRASONIC BACKSCATTER FOR SENSING ELECTRICAL IMPEDANCE OF TISSUE
    Publication number: 20190150882
    Abstract: Described herein is an implantable device configured to detect impedance characteristic of a tissue.
    Type: Application
    Filed: July 7, 2017
    Publication date: May 23, 2019
    Inventors: Michel M. Maharbiz, Jose M. Carmena, Dongjin Seo, Monica Lin, Meir Marmor, Safa Herfat, Chelsea Bahney
  • METHODS AND APPARATUS FOR MONITORING WOUND HEALING USING IMPEDANCE SPECTROSCOPY
    Publication number: 20170156658
    Abstract: Methods and apparatus for real-time, quantifiable monitoring of high-risk areas of biological tissue are described. The methods and apparatus use impedance spectroscopy to detect subtle changes in tissue health.
    Type: Application
    Filed: December 14, 2016
    Publication date: June 8, 2017
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Michel Maharbiz, Vivek Subramanian, Ana Claudia Arias, Sarah Swisher, Amy Liao, Monica Lin, Felippe Pavinatto, Yasser Khan, Daniel Cohen, Elisabeth Leeflang, Shuvo Roy, Michael Harrison, David Young
  • CONDUCTIVE STIFFENER, METHOD OF MAKING A CONDUCTIVE STIFFENER, AND CONDUCTIVE ADHESIVE AND ENCAPSULATION LAYERS
    Publication number: 20170019988
    Abstract: A wearable device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically or thermally connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical and/or thermal energy to the contact pads of the flexible printed circuit board.
    Type: Application
    Filed: July 12, 2016
    Publication date: January 19, 2017
    Inventors: Bryan McGrane, Milan Raj, PingHung Wei, Briana Morey, Roozbeh Ghaffari, Monica Lin, Jeffrey Model, Xianyan Wang, Bryan Keen, Stephen Lee