Patents by Inventor Monica Maria Conejo Herrera

Monica Maria Conejo Herrera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TECHNOLOGIES FOR PACKAGE LOADING MECHANISMS
    Publication number: 20220336322
    Abstract: Techniques for package loading mechanisms are disclosed. In the illustrative embodiment, a base portion of a laptop includes a circuit board on which an integrated circuit component is mounted. A heat sink is mated with the integrated circuit component. A spring presses against part of the chassis of the laptop, pressing the integrated circuit component and the heat sink together, providing strong thermal coupling between them.
    Type: Application
    Filed: June 27, 2022
    Publication date: October 20, 2022
    Applicant: Intel Corporation
    Inventors: Juha T. Paavola, Rob W. Sims, Alonso J. Rodriguez Chacon, Emery E. Frey, Monica Maria Conejo Herrera, Jerrod P. Peterson, Jose R. Diaz, Jose Guillermo Salazar Delgado
  • EXTRUDED HEAT PIPE
    Publication number: 20200391266
    Abstract: Metal is extruded through a feeder plate and an extrusion die to form a heat pipe component that includes a length of pipe and a flange extending outward from the pipe along the length of the pipe. A section of the flange is removed from the extruded heat pipe component, the pipe is sealed and compressed to reduce its thickness and form a heat pipe element for a computing system.
    Type: Application
    Filed: August 28, 2020
    Publication date: December 17, 2020
    Applicant: Intel Corporation
    Inventors: Christopher Michael Moore, Curtis Koepsell, Juha Tapani Paavola, Monica Maria Conejo Herrera, Luis Diego Jimenez Sanchez