Abstract: A low activation temperature heat seal hot melt adhesive for packaging applications based on a blend of metallocene catalyzed polyolefin polymer, tackifying resin, wax and other optional additives. In order to achieve the high viscosity suitable for an extrusion heat seal application, the adhesive composition of the invention is highly loaded with polymer, and thus should have a viscosity of about 50,000 centipoise or more measured at a temperature of 300° F. Accordingly, the hot melt adhesive composition contains about 50% to about 90% by weight of metallocene catalyzed polyolefin polymer, about 5% to about 50% by weight of tackifying resin, about 0.5% to about 40% by weight of wax, about 0.1% to about 5% by weight of a stabilizer or antioxidant, and 0% to about 25% by weight of optional additives. The hot melt adhesive composition must have an activation temperature of about 160° F. or less, and provide a minimum peel force of about 1.

Abstract: A hot melt adhesive comprises a polylactide homopolymer or copolymer, such as polylactic acid; sulfonated copolyester; and at least one plasticizer, and is compostable. The plasticizer may be a solid plasticizer, such as a benzoate, and a second plasticizer may also be used. The adhesive is suitable for use in a variety of applications, such as case and carton applications, use with burlap or other compostable substrates for tree bulbs or plant seeds, and use with other compostable films, and is especially appropriate for dual-walled paperboard beverage cups. The adhesive demonstrates good bond performance comparable to non-compostable adhesives over a range of temperatures, reflective of the temperatures of hot and cold beverages.

Abstract: A hot melt adhesive comprises a polylactide homopolymer or copolymer, such as polylactic acid; sulfonated copolyester; and at least one plasticizer, and is compostable. The plasticizer may be a solid plasticizer, such as a benzoate, and a second plasticizer may also be used. The adhesive is suitable for use in a variety of applications, such as case and carton applications, use with burlap or other compostable substrates for tree bulbs or plant seeds, and use with other compostable films, and is especially appropriate for dual-walled paperboard beverage cups. The adhesive demonstrates good bond performance comparable to non-compostable adhesives over a range of temperatures, reflective of the temperatures of hot and cold beverages.

Abstract: A hot melt adhesive comprises a polylactide homopolymer or copolymer, such as polylactic acid; sulfonated copolyester; and at least one plasticizer, and is compostable. The plasticizer may be a solid plasticizer, such as a benzoate, and a second plasticizer may also be used. The adhesive is suitable for use in a variety of applications, such as case and carton applications, use with burlap or other compostable substrates for tree bulbs or plant seeds, and use with other compostable films, and is especially appropriate for dual-walled paperboard beverage cups. The adhesive demonstrates good bond performance comparable to non-compostable adhesives over a range of temperatures, reflective of the temperatures of hot and cold beverages.

Abstract: A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin polymer as a secondary polymer in the composition, about 10% to about 70% by weight of a suitable plasticizer, about 0% to about 30% by weight of a wax, about 0% to about 50% by weight of one or more tackifying resins, about 0.1% to about 4% by weight of a stabilizer, and about 0% to about 3% by weight of auxiliary additives, so that the viscosity of the composition is equal to or less than about 10,000 cP at 163° C. The formulation balances the cohesive and adhesive strength required to insure the adhesive fails cohesively to prevent paper tear.

Abstract: A hot melt adhesive composition containing a functionalized polymer, namely, a metallocene catalyzed polyolefin elastomer grafted with maleic anhydride, together with a non-functionalized secondary polymer, namely, a metallocene catalyzed random or block polyolefin elastomer having a melt index equal to or greater than 15, a first tackifying resin having a softening point of at least 95° C., and a wax. The composition may optionally include an aromatic reinforcing resin having a softening point equal to or higher than 115° C., and a plasticizer. These hot melts provide superior hot tack, excellent adhesion, flexibility, and heat resistance above 150° F. in applications such as rigid packaging, hot fill packaging, and bottle labeling.

Abstract: A hot melt adhesive composition containing a functionalized polymer, namely, a metallocene catalyzed polyolefin elastomer grafted with maleic anhydride, together with a non-functionalized secondary polymer, namely, a metallocene catalyzed random or block polyolefin elastomer having a melt index equal to or greater than 15, a first tackifying resin having a softening point of at least 95° C., and a wax. The composition may optionally include an aromatic reinforcing resin having a softening point equal to or higher than 115° C., and a plasticizer. These hot melts provide superior hot tack, excellent adhesion, flexibility, and heat resistance above 150° F. in applications such as rigid packaging, hot fill packaging, and bottle labeling.

Abstract: A low activation temperature heat seal hot melt adhesive for packaging applications based on a blend of metallocene catalyzed polyolefin polymer, tackifying resin, wax and other optional additives. In order to achieve the high viscosity suitable for an extrusion heat seal application, the adhesive composition of the invention is highly loaded with polymer, and thus should have a viscosity of about 50,000 centipoise or more measured at a temperature of 300° F. Accordingly, the hot melt adhesive composition contains about 50% to about 90% by weight of metallocene catalyzed polyolefin polymer, about 5% to about 50% by weight of tackifying resin, about 0.5% to about 40% by weight of wax, about 0.1% to about 5% by weight of a stabilizer or antioxidant, and 0% to about 25% by weight of optional additives. The hot melt adhesive composition must have an activation temperature of about 160° F. or less, and provide a minimum peel force of about 1.

Abstract: A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin polymer as a secondary polymer in the composition, about 10% to about 70% by weight of a suitable plasticizer, about 0% to about 30% by weight of a wax, about 0% to about 50% by weight of one or more tackifying resins, about 0.1% to about 4% by weight of a stabilizer, and about 0% to about 3% by weight of auxiliary additives, so that the viscosity of the composition is equal to or less than about 10,000 cP at 163° C. The formulation balances the cohesive and adhesive strength required to insure the adhesive fails cohesively to prevent paper tear.

Abstract: A hot melt adhesive composition containing a functionalized polymer, namely, a metallocene catalyzed polyolefin elastomer grafted with maleic anhydride, together with a non-functionalized secondary polymer, namely, a metallocene catalyzed random or block polyolefin elastomer having a melt index equal to or greater than 15, a first tackifying resin having a softening point of at least 95° C., and a wax. The composition may optionally include an aromatic reinforcing resin having a softening point equal to or higher than 115° C., and a plasticizer. These hot melts provide superior hot tack, excellent adhesion, flexibility, and heat resistance above 150° F. in applications such as rigid packaging, hot fill packaging, and bottle labeling.

Abstract: A hot melt adhesive composition, comprising a blend of components including about 5% to about 50% by weight of an olefin block copolymer; about 10% to about 70% by weight of a first tackifying resin having a softening point of at least about 95° C.; about 0 to 65% of a second tackifying resin that is different than the first tackifying resin; about 0% to about 60% by weight of a plasticizer; about 0% to about 20% by weight of an aromatic reinforcing resin having a softening point equal to or higher than 115° C.; about 0.1% to about 5% by weight of a stabilizer; and about 1% to about 40% by weight of a secondary polymer that is different from the olefin block copolymer, the first and second tackifying resins and the reinforcing resin, having relatively low crystallinity, which low crystallinity is equal to or less than 250 Joules/gram, wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 mPa·s at 163° C.

Abstract: A hot melt adhesive composition, comprising a blend of components including about 5% to about 50% by weight of an olefin block copolymer; about 10% to about 70% by weight of a first tackifying resin having a softening point of at least about 95° C.; about 0 to 65% of a second tackifying resin that is different than the first tackifying resin; about 0% to about 60% by weight of a plasticizer; about 0% to about 20% by weight of an aromatic reinforcing resin having a softening point equal to or higher than 115° C.; about 0.1% to about 5% by weight of a stabilizer; and about 1% to about 40% by weight of a secondary polymer that is different from the olefin block copolymer, the first and second tackifying resins and the reinforcing resin, having relatively low crystallinity, which low crystallinity is equal to or less than 250 Joules/gram, wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 mPa·s at 163° C.

Abstract: A polybutylene-based hot melt adhesive composition having a variety of end uses, particularly in construction and elastic attachment applications on nonwoven disposable articles. Unlike typical hot melt adhesives, the present composition can withstand exposure to emollients such as mineral oil and other oil-based ointments without experiencing catastrophic bond failure. The composition includes a polybutylene-based polymer or a mixture of a polybutylene-based polymer and a polyalphaolefin polymer, a tackifier resin, a plasticizer, a wax and a stabilizer. The hot melt adhesive composition can be applied using common application techniques such as extruding or spraying.