Patents by Inventor Monina Dadap Kanderski

Monina Dadap Kanderski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7262251
    Abstract: A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%-50% by weight of the RCP copolymer, about 20%-65% by weight of a compatible tackifier, about 0%-40% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, about 0%-40% by weight of a wax, about 0%-60% by weight of an atactic poly-?-olefin (APAO), and about 0%-40% by weight of a secondary polymer. The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.
    Type: Grant
    Filed: October 27, 2003
    Date of Patent: August 28, 2007
    Assignee: Bostik Findley, Inc.
    Inventors: Monina Dadap Kanderski, Lacretia A. Svenningsen, Diane M. Strelow, Chongyao Zhang, Mark A. Gibes, Baoyu Wang
  • Patent number: 7067585
    Abstract: A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%–50% by weight of the RCP copolymer, about 20%–65% by weight of a compatible tackifier, about 0%–40% by weight of a plasticizer, about 0%–3% by weight of a stabilizer, about 0%–40% by weight of a wax, and optionally about 0%–60% by weight of an atactic poly-?-olefin (APAO). The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: June 27, 2006
    Assignee: Bostik, Inc.
    Inventors: Baoyu Wang, Monina Dadap Kanderski, Lacretia A. Svenningsen, Diane M. Strelow, Chongyao Zhang, Mark A. Gibes
  • Publication number: 20040115456
    Abstract: A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%-50% by weight of the RCP copolymer, about 20%-65% by weight of a compatible tackifier, about 0%-40% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, about 0%-40% by weight of a wax, about 0%-60% by weight of an atactic poly-&agr;-olefin (APAO), and about 0%-40% by weight of a secondary polymer. The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.
    Type: Application
    Filed: October 27, 2003
    Publication date: June 17, 2004
    Inventors: Monina Dadap Kanderski, Lacretia A. Svenningsen, Diane M. Strelow, Chongyao Zhang, Mark A. Gibes, Baoyu Wang
  • Publication number: 20040081795
    Abstract: A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%-50% by weight of the RCP copolymer, about 20%-65% by weight of a compatible tackifier, about 0%-40% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, about 0%-40% by weight of a wax, and optionally about 0%-60% by weight of an atactic poly-&agr;-olefin (APAO). The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.
    Type: Application
    Filed: October 28, 2002
    Publication date: April 29, 2004
    Inventors: Baoyu Wang, Monina Dadap Kanderski, Lacretia A. Svenningsen, Diane M. Strelow, Chongyao Zhang, Mark A. Gibes