Patents by Inventor Monnir Boureghda
Monnir Boureghda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11699632Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.Type: GrantFiled: January 20, 2021Date of Patent: July 11, 2023Assignee: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
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Publication number: 20220241852Abstract: A method of making a combined sinter-ready silver film and carrier (1) comprises the steps of: a) creating a carrier (2) comprising designed openings (5); b) casting a silver film layer (7) into the designed openings (5), for example casting a silver paste; and c) drying the carrier (2) and silver film layer (7) to form the combined sinter-ready silver film and carrier (1). The carrier (2) may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier (2) may comprise a stencil layer (3) and a backing layer (4). The stencil layer (3) may define the designed openings (5). The backing layer (4) may be configured for sealing a bottom of the designed openings (5), wherein at the start of step b), a top of the designed openings (5) may be open for receiving the cast silver film layer (7).Type: ApplicationFiled: May 5, 2020Publication date: August 4, 2022Inventors: Oscar KHASELEV, Matthew James SIEBENHUHNER, Monnir BOUREGHDA, Mike MARCZI, Carl BILGRIEN
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Patent number: 11390054Abstract: A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.Type: GrantFiled: July 13, 2020Date of Patent: July 19, 2022Assignee: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
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Publication number: 20220169905Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: October 4, 2021Publication date: June 2, 2022Applicant: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Patent number: 11162007Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: GrantFiled: March 1, 2019Date of Patent: November 2, 2021Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Publication number: 20210289680Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.Type: ApplicationFiled: January 20, 2021Publication date: September 16, 2021Applicant: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
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Patent number: 10905041Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.Type: GrantFiled: September 16, 2013Date of Patent: January 26, 2021Assignee: Alpha Assembly Solutions Inc.Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
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Publication number: 20200338859Abstract: A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.Type: ApplicationFiled: July 13, 2020Publication date: October 29, 2020Applicant: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
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Patent number: 10710336Abstract: Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.Type: GrantFiled: August 29, 2014Date of Patent: July 14, 2020Assignee: Alpha Assembly Solutions Inc.Inventors: Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
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Patent number: 10535628Abstract: Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.Type: GrantFiled: November 2, 2011Date of Patent: January 14, 2020Assignee: Alpha Assembly Solutions Inc.Inventors: Oscar Khaselev, Bin Mo, Michael T. Marczi, Bawa Singh, Monnir Boureghda
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Publication number: 20190194517Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: March 1, 2019Publication date: June 27, 2019Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Patent number: 10259980Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: GrantFiled: October 29, 2013Date of Patent: April 16, 2019Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Publication number: 20160225737Abstract: Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.Type: ApplicationFiled: February 8, 2016Publication date: August 4, 2016Inventors: Oscar Khaselev, Bawa Singh, Bin Mo, Michael T. Marczi, Monnir Boureghda
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Publication number: 20160207286Abstract: Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.Type: ApplicationFiled: August 29, 2014Publication date: July 21, 2016Inventors: Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
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Publication number: 20150353804Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: October 29, 2013Publication date: December 10, 2015Applicant: ALPHA METALS, INC.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Publication number: 20140153203Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.Type: ApplicationFiled: September 16, 2013Publication date: June 5, 2014Applicant: ALPHA METALS, INC.Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
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Patent number: 8555491Abstract: Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.Type: GrantFiled: July 17, 2008Date of Patent: October 15, 2013Assignee: Alpha Metals, Inc.Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
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Publication number: 20120114927Abstract: Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.Type: ApplicationFiled: November 2, 2011Publication date: May 10, 2012Inventors: Oscar Khaselev, Bawa Singh, Bin Mo, Michael T. Marczi, Monnir Boureghda
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Publication number: 20090025967Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.Type: ApplicationFiled: July 17, 2008Publication date: January 29, 2009Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh