Patents by Inventor Monolithic 3D Inc.

Monolithic 3D Inc. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE
    Publication number: 20130119557
    Abstract: Two systems including: a first system including a first die connected to a second die; and a second system including a third die connected to a fourth die; wherein the connected includes at least one through silicon via (TSV), and wherein the first die is substantially the same as the third die, and the second die is substantially different than the fourth die.
    Type: Application
    Filed: November 21, 2012
    Publication date: May 16, 2013
    Applicant: MONOLITHIC 3D INC.
    Inventor: Monolithic 3D Inc.