Patents by Inventor Monte L. Kopp

Monte L. Kopp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5383792
    Abstract: An electrical connector (2) has a dielectric housing with contact terminals (22) which extend therethrough. The contact terminals (22) are provided to electrically connect a mother board (4) to a daughter card (6). A board-receiving opening (20) is provided in the housing for reception of the daughter card (6) therein. Proximate to the board-receiving opening (20) are latch receiving openings (24) which are dimensioned to receive insertable latch members (40) therein. The latch members (40) are manufactured from material having the desired resilient and strength characteristics, thereby insuring that the latch members (40) will be effective over many cycles. Each latch member (40) has a resilient section (42) for cooperating with the daughter card (6) and a mounting section (44) for cooperating with the mother board (4). The resilient section (42) is able to accommodate a range of board sizes without taking a permanent set.
    Type: Grant
    Filed: March 4, 1993
    Date of Patent: January 24, 1995
    Assignee: The Whitaker Corporation
    Inventors: Iosif Korsunsky, Richard C. Schroepfer, Monte L. Kopp
  • Patent number: 4986765
    Abstract: An electrical connector (2) has a dielectric housing with contact terminals (22) which extend therethrough. The contact terminals (22) are provided to electrically connect a mother board (4) to a daughter card (6). A board-receiving opening (20) is provided in the housing for reception of the daughter card (6) therein. Proximate to the board-receiving opening (20) are latch receiving openings (24) which are dimensioned to receive insertable latch members (40) therein. The latch members (40) are manufactured from material having the desired resilient and strength characteristics, thereby insuring that the latch members (40) will be effective over many cycles. Each latch member (40) has a resilient section (42) for cooperating with the daughter card (6) and a mounting section (44) for cooperating with the mother board (4). The resilient section (42) is able to accommodate a range of board sizes without taking a permanent set.
    Type: Grant
    Filed: February 21, 1989
    Date of Patent: January 22, 1991
    Assignee: AMP Incorporated
    Inventors: Iosif Korsunsky, Richard C. Schroepfer, Monte L. Kopp
  • Patent number: 4968259
    Abstract: Chip carrier sockets, for providing an electrical connection between a first electrical component and a second electrical component, have terminals provided therein, the terminals have contacting portions and retention portions provided thereon. The contacting portions are provided to electrically engage leads of a chip carrier with is positioned in a recess of the chip carrier socket. A spacer is provided between the contacting portions and the retention portions, such that the spacer has a greater width than the distance provided between the contacting portion and the retention portion, This spacing, in combination with a resilient member, insure that the spacer is resiliently forced against the contacting portion and the retention portion, thereby insuring that the first electrical component will be positioned and maintained in electrical engagement with the contact portion of the terminal.
    Type: Grant
    Filed: August 11, 1989
    Date of Patent: November 6, 1990
    Inventors: Iosif Korsunsky, Monte L. Kopp, Dimitry G. Grabbe
  • Patent number: 4941832
    Abstract: A chip carrier socket has terminals (2) positioned therein to provide an electrical connection between a chip carrier (4) and a substrate (6). The terminals (2) have first arms (10) which cooperate with the chip carrier (4), second arms (12) which engage the housing of the chip carrier socket, and mounting arms (32) which are placed in electrical engagement with the substrate (6). Engagement means (38) are provided between the first arms (10) and the mounting arms (32), and provide a shortened path across which the electrical signals can travel from the chip carrier to the substrate. The engagement means (38) also provide a frictional engagement between the first arms (10) and the mounting arms (32), thereby reducing the resilient characteristics required in the mounting arms.
    Type: Grant
    Filed: January 30, 1989
    Date of Patent: July 17, 1990
    Assignee: AMP Incorporated
    Inventors: Iosif Korsunsky, Monte L. Kopp, Dimitry G. Grabbe