Abstract: An apparatus and method for handling pipes in a derrick and racking the pipes on a pipe racking assembly mounted on the derrick. The apparatus includes a rotatable gate assembly rotatably mounted on the pipe racking assembly. The rotatable gate assembly includes a collar rotatably mounted to a first end of a rotatable pipe support. A pipe manipulator arm is pivotably mounted on a second end of the rotatable gate assembly. The collar defines a gate for securing an upper portion of the pipe stand. A pipe mount is mounted to a distal end of the arm for holding the pipe stand for transport between the derrick and the gate, and between the gate and the pipe rack. After the arm secures the pipe stand into the gate from the derrick, a drive mechanism rotates the rotatable gate assembly to a rack facing position from the derrick facing position such that the arm may transport the pipe between the gate and the pipe rack.

Abstract: An apparatus for handling pipes in a derrick and racking the pipes on a pipe racking assembly mounted on the derrick is provided to improve the stability of transferring pipes during a round trip operation. The apparatus includes a rotatable gate assembly mounted on the pipe racking assembly. The rotatable gate assembly includes a collar rotatably mounted to a first end of a shaft and an arm pivotably and rotatably mounted on a second end of the shaft. The collar defines a gate for securing an upper portion of the pipe stand. A first securing means mounted to a second end of the arm secures the mid-portion of the pipe stand and a second securing means mounted to the first securing means secures the lower portion of the pipe stand. After the arm secures the pipe stand from the derrick, a drive mechanism mounted to the shaft rotates the rotatable gate assembly such that the arm may rack the pipe on the pipe racking assembly.

Abstract: A colloidal silica slurry containing triethanolamine is used in a chemical mechanical polishing process to polish multiple material substrates, such as silicon wafers containing silicon oxide where a thin underlayer of silicon nitride is used as a stop layer. The colloidal silica slurry containing triethanolamine is capable of achieving an oxide to nitride selectivity during polishing up to a demonstrated ratio of 28:1.

Abstract: The present invention relates to a chemical mechanical polishing (CMP) machine and method in which at least one polishing device is provided with a vertically-oriented polishing surface and a slurry delivery mechanism. As a result, the footprint of the machine is greatly reduced and the prevention of contaminants embedding in the polishing device can be promoted.

Abstract: A desired reagent is delivered to a workpiece undergoing a chemical mechanical polishing process with a chemical mechanical planarization apparatus. A slurry and polishing pad are provided for the polishing process. Reagent containing microcapsules are also provided, the microcapsules encapsulating a desired reagent. The workpiece is polished with a combination of the slurry, the polishing pad, and the microcapsules, wherein the encapsulated reagents are controllably released during the polishing step via manipulation of a polishing parameter. In one embodiment, the microcapsules are included in the slurry. In an alternate embodiment, the microcapsules are embedded within the polishing pad.