Abstract: Cooling device (15) for cooling semiconductor switching elements (10, 11), comprising a first wall (17) having a first side (18) for carrying the semiconductor switching elements (10, 11) and having a second side (19) being opposite the first side (18), a second wall (20) having a first side (21) that forms a main cooling channel (22) together with the second side (19) of the first wall (17) and having a second side (25) being opposite to the first side (21) of the second wall (20), and a third wall (23) that forms an auxiliary cooling channel (24) together with the second side (25) of the second wall (20), wherein the second wall (20) comprises a connection means (26) that connects the auxiliary cooling channel (24) with the main cooling channel (22) in a fluid-conductive manner.

Abstract: A power module for an inverter is disclosed. The power module has a base plate with a first base plate side and a second, opposite base plate side, controllable electronic switches arranged on the first base plate side, inputs and outputs, which are electrically connected to the electronic switches. The power module is designed to convert an input voltage applied to the inputs to an output voltage applied to the outputs by the electronic switches. The power module also includes a plurality of cooling devices attached to the second base plate side. The cooling devices each have loops arranged one behind the other. The loops of a first group of cooling devices are inclined with respect to the loops of a second group of cooling devices, and/or the loops of each group of cooling devices protrude from the second base plate side to different distances.