Abstract: A photoresist composition includes an organometallic compound, which includes at least one metal-ligand bond including a metal core and at least one organic ligand bonded to the metal core; at least one first organic ligand precursor, which is different in chemical structure from the at least one organic ligand of the organometallic compound, and which includes a phosphonic acid group and has a structure capable of forming a coordination complex with the metal core; and a solvent. A method of manufacturing an integrated circuit device includes forming a photoresist film on a substrate using the photoresist composition, and forming a modified organometallic compound by binding an organic ligand including a phosphonic acid group to the organometallic compound through a ligand exchange between the organometallic compound and the at least one first organic ligand precursor based on chemical equilibrium in the photoresist film.

Abstract: The present invention relates to silver particles capable of having a uniform particle distribution, preventing agglomeration of a powder, and significantly improving dispersibility, the silver particles each having pores therein, and to a manufacturing method therefor and, more specifically, to a manufacturing method for silver particles, the method comprising a silver-complex forming step, a silver slurry preparing step, and a silver particle obtaining step, and to silver particles manufactured therefrom.

Abstract: The present invention relates to silver particles capable of having a uniform particle distribution, preventing agglomeration of a powder, and significantly improving dispersibility, the silver particles each having pores therein, and to a manufacturing method therefor and, more specifically, to a manufacturing method for silver particles, the method comprising a silver-complex forming step, a silver slurry preparing step, and a silver particle obtaining step, and to silver particles manufactured therefrom.