Abstract: The invention relates to a method for fabricating an organic electronic device. The organic electronic device is fabricated by forming a first electrode layer, a plurality of organic layers and a second electrode layer sequentially on a substrate. In forming at least one of the organic layers, a donor film is coated with organic material to form an organic layer. The organic layer formed on the donor film is positioned on the first electrode layer or another one of the organic layers of the organic electronic device. Also, the organic layer is thermal-transferred to the first electrode layer or another organic layer. Finally, the donor film is removed from the organic layer.

Abstract: A mask holder for irradiating UV-rays is disclosed in the present invention. The mask holder includes a lower part having a frame and a mask supporting member supporting a mask, wherein the mask supporting member is in the frame and has a plurality of first connecting portions, and an upper part having a plurality of second connecting portions to be aligned with the first connecting portions.

Abstract: Disclosed is a system for fabricating a liquid crystal display using liquid crystal dropping and a method of fabricating a liquid crystal display using the same. The present invention includes a liquid crystal forming line dropping liquid crystals on the first substrate, a sealant forming line forming the sealant on the second substrate, and a bonding and hardening line bonding the two substrates to each other and hardening the sealant, printing a sealant, bonding the substrates each other, and hardening the sealant and an inspection process line of cutting the bonded substrates into panel units and grinding and inspecting the unit panels.

Abstract: The present invention discloses a liquid crystal display panel and a method for fabricating the same including a main UV sealant on a substrate, a first dummy UV sealant outside the main UV sealant, and a second dummy UV sealant outside the first dummy UV sealant.

Abstract: Disclosed is a system for fabricating a liquid crystal display using liquid crystal dropping and a method of fabricating a liquid crystal display using the same. The present invention includes a liquid crystal forming line dropping liquid crystals on the first substrate, a sealant forming line forming the sealant on the second substrate, and a bonding and hardening line bonding the two substrates to each other and hardening the sealant, printing a sealant, bonding the substrates each other, and hardening the sealant and an inspection process line of cutting the bonded substrates into panel units and grinding and inspecting the unit panels.

Abstract: Disclosed is a WDM system for demultiplexing mixed optical signals transmitted through one channel from the outside to distribute specific wavelength optical signals into a plurality of channels. The WDM system has a receiving optical fiber for receiving the mixed optical signals. A filter is arranged in an output end of the receiving optical fiber for selectively transmitting a specific optical signal of a wavelength identical with the peak wavelength of the filter but reflecting remaining wavelength optical signals. A transmitting optical fiber outputs the specific wavelength optical signal transmitted through the filter. A shutter member attenuates the specific wavelength optical signal between the filter and the transmitting optical fiber. An actuator drives the shutter member across the propagation of the specific wavelength optical signal transmitted through the filter; and a control unit for controlling the actuation of the actuator.

Abstract: The present invention relates to a micro optical communication device package. The package of the invention comprises a Micro-Electro-Mechanical System (MEMS) chip for executing an optical communication function. The MEMS chip is mounted on a base. An upper housing having an opened bottom is placed on the base to form an internal space together with the base. The upper housing is sealed with the base to hermetically seal the MEMS chip within the internal space. The MEMS chip is connected an optical fiber, which is extended through the upper housing to form a light path. A boot is fit around the optical fiber and fixed to the upper housing to seal a portion of the upper housing for allowing passage of the optical fiber.