Patents by Inventor Moo Song

Moo Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250136753
    Abstract: The present disclosure relates to a polyester polymer including: a polymer matrix containing a polyester repeating unit; and a mono-metallic salt of a polyvalent inorganic acid and a multi-metallic salt of a polyvalent inorganic acid that remain in the polymer matrix, a method for preparing the same and a catalyst system.
    Type: Application
    Filed: June 8, 2023
    Publication date: May 1, 2025
    Inventors: Jeongnam KIM, Mooho HONG, Moo Song SEO, Yeonji CHOE
  • Patent number: 12024626
    Abstract: The present disclosure provides a thermoplastic copolymer composition capable of improving low noise properties without deterioration in mechanical properties, which is used in manufacture of a molded article, such as a constant velocity joint boot used as a component of an automobile.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: July 2, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Sung Moon Choi, Hyung Min Ahn, Kyu Young Kim, Moo Song Seo, Jung Woo Kim, Min Han Kwak, Dae Chul Kim
  • Publication number: 20230312816
    Abstract: The present invention relates to a polyester molded body and a method for manufacturing the same, the polyester molded body including polyester obtained by polymerization in the presence of an inorganic tin compound catalyst, wherein the polyester molded body containing an inorganic tin compound of the present invention may overcome problems caused by a residual antimony-based catalyst, and may be used as an eco-friendly container which does not affect taste and aroma when used as a food storage container due to reduced amounts of acetaldehyde and formaldehyde and which is not toxic to the human body.
    Type: Application
    Filed: August 18, 2021
    Publication date: October 5, 2023
    Inventors: Chon Ki KIM, Mee So PARK, Moo Song KIM
  • Publication number: 20230295841
    Abstract: The present invention relates to polyester yarn containing polyester obtained by polymerization in the presence of an inorganic tin compound catalyst, and a method for manufacturing the polyester yarn, wherein the polyester yarn of the present invention which contains an inorganic tin compound may overcome problems caused by a residual antimony catalyst and may have excellent warping properties.
    Type: Application
    Filed: August 18, 2021
    Publication date: September 21, 2023
    Inventors: Chon Ki KIM, Moo Song KIM, Joong Yeol KIM, Mee So PARK
  • Publication number: 20230192945
    Abstract: A polyethylene terephthalate bulked continuous filament is manufactured by steps of melt-spinning, multi-step stretching a polyethylene terephthalate chip and a master batch chip for coloring, passing through a texturing nozzle, cooling, and winding and has an elastic modulus of 1.00E+07 to 5.00E+09Pa at a temperature range of 10° C. to 200° C., the filament being manufactured by steps of melt-spinning a polyethylene terephthalate chip and a master batch chip for coloring, multi-step stretching, passing through a texturing nozzle, cooling, and winding.
    Type: Application
    Filed: February 23, 2023
    Publication date: June 22, 2023
    Inventors: Seung Taek OH, Moo Song Kim
  • Patent number: 11634536
    Abstract: A polyethylene terephthalate bulked continuous filament is manufactured by steps of melt-spinning, multi-step stretching a polyethylene terephthalate chip and a master batch chip for coloring, passing through a texturing nozzle, cooling, and winding and has an elastic modulus of 1.00E+07 to 5.00E+09 Pa at a temperature range of 10° C. to 200° C., the filament being manufactured by steps of melt-spinning a polyethylene terephthalate chip and a master batch chip for coloring, multi-step stretching, passing through a texturing nozzle, cooling, and winding.
    Type: Grant
    Filed: February 10, 2019
    Date of Patent: April 25, 2023
    Assignee: HYOSUNG ADVANCED MATERIALS CORPORATION
    Inventors: Seung Taek Oh, Moo Song Kim
  • Publication number: 20220169784
    Abstract: Disclosed are a polymerization catalyst for the production of polyester, which includes an inorganic stannous (tin (II)) compound, and a method of producing polyester using the same. The polymerization catalyst for the production of polyester is safe without toxicity, has equal or higher catalytic activity compared to an antimony-based catalyst, may increase the polymerization reaction rate, may ensure a high viscosity level even when used in small amounts, may reduce the production of acetaldehyde, and may also improve the thermal stability and color of the polymer compared to those of a polyester polymer obtained by the related art.
    Type: Application
    Filed: April 2, 2020
    Publication date: June 2, 2022
    Inventors: Chon Ki KIM, Mee So PARK, Moo Song KIM
  • Publication number: 20210189116
    Abstract: The present disclosure provides a thermoplastic copolymer composition capable of improving low noise properties without deterioration in mechanical properties, which is used in manufacture of a molded article, such as a constant velocity joint boot used as a component of an automobile.
    Type: Application
    Filed: August 3, 2020
    Publication date: June 24, 2021
    Inventors: Sung Moon CHOI, Hyung Min AHN, Kyu Young KIM, Moo Song SEO, Jung Woo KIM, Min Han KWAK, Dae Chul KIM
  • Patent number: 10993043
    Abstract: Provided is a MEMS acoustic sensor including a substrate and a cavity, a back plate supported on the substrate and including a plurality of through-holes, at least one anchor projecting from the back plate toward the substrate, and a diaphragm supported by the at least one anchor and deformed by a sound wave introducing from the outside through the cavity, wherein no part of the deformed diaphragm comes into contact with the substrate.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: April 27, 2021
    Assignee: SHIN SUNG C&T CO., LTD.
    Inventors: Sang woo Lee, Ci Moo Song, Keun Jung Youn, Yong Kook Kim, Kyu dong Jung, Muhammad Ali Shah
  • Publication number: 20210076141
    Abstract: Provided is a MEMS acoustic sensor including a substrate and a cavity, a back plate supported on the substrate and including a plurality of through-holes, at least one anchor projecting from the back plate toward the substrate, and a diaphragm supported by the at least one anchor and deformed by a sound wave introducing from the outside through the cavity, wherein no part of the deformed diaphragm comes into contact with the substrate.
    Type: Application
    Filed: September 9, 2019
    Publication date: March 11, 2021
    Applicant: SHIN SUNG C&T CO., LTD.
    Inventors: Sang woo LEE, Ci Moo SONG, Keun Jung YOUN, Yong Kook KIM, Kyu dong JUNG, Muhammad Ali SHAH
  • Patent number: 10824071
    Abstract: Multiple model functions may be calculated by detecting alignment marks on a semiconductor wafer structure. The model functions may be combined to determine a combined model function by using a weight function that assigns a different weight to each of basis functions of the model functions. Thus, even when asymmetry of alignment marks or overlay marks has high dependency on a horizontal location on a wafer, reliability of exposure process is insured.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: November 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Moo-song Lee, Seung-yoon Lee
  • Publication number: 20200110332
    Abstract: Multiple model functions may be calculated by detecting alignment marks on a semiconductor wafer structure. The model functions may be combined to determine a combined model function by using a weight function that assigns a different weight to each of basis functions of the model functions. Thus, even when asymmetry of alignment marks or overlay marks has high dependency on a horizontal location on a wafer, reliability of exposure process is insured.
    Type: Application
    Filed: June 4, 2019
    Publication date: April 9, 2020
    Inventors: MOO-SONG LEE, Seung-yoon Lee
  • Publication number: 20200071459
    Abstract: A polyethylene terephthalate bulked continuous filament is manufactured by steps of melt-spinning, multi-step stretching a polyethylene terephthalate chip and a master batch chip for coloring, passing through a texturing nozzle, cooling, and winding and has an elastic modulus of 1.00E+07 to 5.00E+09 Pa at a temperature range of 10° C. to 200° C.
    Type: Application
    Filed: February 10, 2019
    Publication date: March 5, 2020
    Inventors: Seung Taek OH, Moo Song KIM
  • Patent number: 10366271
    Abstract: Fingerprint sensing technology of a fingerprint sensor for authenticating whether a fingerprint of a subject is forged or falsified by using a waveform reflected from the subject, such as an ultrasonic wave. The fingerprint authentication apparatus includes a fingerprint sensor configured to apply a wave signal to a subject and receive a wave signal reflected from the subject, a local waveform detector configured to detect local waveforms by dividing the received wave signal by a reception time, and a forgery detection unit configured to count the number of local waveforms and detect whether a fingerprint provided from the subject is forged or not based on the counted number of local waveforms.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: July 30, 2019
    Assignee: SHIN SUNG C&T CO., LTD.
    Inventors: Jae Hyun Ahn, Ci Moo Song, Keun Jung Youn, Yong Kook Kim
  • Publication number: 20190152774
    Abstract: The MEMS sensor includes: a device substrate on which a device pattern is formed; a cap substrate disposed on top of the device substrate, the cap substrate comprising a first cavity area; a base substrate disposed on the bottom of the device substrate; a first-through silicon via formed through the base substrate, the first-through silicon via including a first core area for outputting an electrical signal provided from the device pattern to the outside or transmitting an electrical signal provided from the outside to the device pattern, a first insulating area surrounding an outer surface of the first core area, a first peripheral area surrounding an outer surface of the first insulating area, and a second insulating area surrounding an outer surface of the first peripheral area; and a circuit board, electrically connected to the first-through silicon via, for processing electrical signals for the device pattern.
    Type: Application
    Filed: January 24, 2019
    Publication date: May 23, 2019
    Applicant: SHIN SUNG C&T CO., LTD.
    Inventors: Ci Moo SONG, Keun Jung YOUN, Do Hyeon LEE, Yong Kook KIM, Jae Hyun AHN
  • Publication number: 20190033341
    Abstract: The present invention relates to a MEMS-based three-axis acceleration sensor and, more specifically, comprises: an x-axis sensor mass sensing an external acceleration inputted in the direction of a first axis parallel to a bottom wafer substrate; a y-axis sensor mass sensing an external acceleration inputted in the direction of a second axis parallel to the bottom wafer substrate and perpendicular to the first axis; and a z-axis sensor mass formed so as to encompass the x-axis sensor mass and the y-axis sensor mass and sensing an external acceleration inputted in the direction of a third axis perpendicular to the bottom wafer substrate, wherein space is saved and accelerations in the three axis directions are respectively measured by sensing the independent movement of each axis sensor mass.
    Type: Application
    Filed: September 24, 2018
    Publication date: January 31, 2019
    Applicant: SHIN SUNG C&T CO., LTD.
    Inventors: Ci Moo SONG, Keun Jung YOUN, Do Hyeon LEE, Yong Kook KIM
  • Publication number: 20180196984
    Abstract: The present disclosure relates to fingerprint sensing technology of a fingerprint sensor to be used, and more particularly to an apparatus for authenticating whether a fingerprint of a subject is forged or falsified by using a waveform reflected from the subject, such as an ultrasonic wave. The fingerprint authentication apparatus includes a fingerprint sensor configured to apply a wave signal to a subject and receive a wave signal reflected from the subject, a local waveform detector configured to detect local waveforms by dividing the received wave signal by a reception time, and a forgery detection unit configured to count the number of local waveforms and detect whether a fingerprint provided from the subject is forged or not based on the counted number of local waveforms.
    Type: Application
    Filed: January 4, 2018
    Publication date: July 12, 2018
    Applicant: SHIN SUNG C&T CO., LTD.
    Inventors: Jae Hyun AHN, Ci Moo SONG, Keun Jung YOUN, Yong Kook KIM
  • Publication number: 20180158742
    Abstract: Provided is a semiconductor package. The semiconductor package comprises: a device substrate having a device pattern formed thereon; a cap substrate overlying the device substrate and comprising a first cavity area; a base substrate underlying the device substrate and comprising a second cavity area formed in the position corresponding to the first cavity area and at least one first through-silicon via that outputs, to the outside, an electrical signal provided from the device pattern or transmits, to the device pattern, an electrical signal provided from the outside; and a circuit substrate underlying the base substrate and electrically connected with the first through-silicon via to process an electrical signal for the device pattern.
    Type: Application
    Filed: January 10, 2018
    Publication date: June 7, 2018
    Applicant: SHIN SUNG C&T CO., LTD.
    Inventors: Ci Moo SONG, Keun Jung YOUN, Jeong Sik KANG, Yong Kook KIM
  • Publication number: 20180135985
    Abstract: A MEMS gyroscope including: a frame arranged parallel to a bottom wafer substrate; a sensor mass body excited at one degree of freedom in an excitation mode, and of which the displacement is sensed at two degrees of freedom by a Coriolis force in a sensing mode when an external angular velocity is input to the frame; and at least two sensing electrode for sensing a displacement of the sensor mass body, the displacement being sensed at the two degrees of freedom, wherein the sensor mass body comprises an inner mass body and an outer mass body surrounding the inner mass body, the outer mass body and the frame are connected by a first support spring, and the outer mass body and the inner mass body are connected by a second support spring.
    Type: Application
    Filed: November 9, 2017
    Publication date: May 17, 2018
    Applicant: SHIN SUNG C&T CO., LTD.
    Inventors: Ci Moo SONG, Keun Jung YOUN, Jeong Sik KANG, Yong Kook KIM, Seung Ho HAN, Hyun Ju SONG
  • Publication number: 20180135984
    Abstract: A MEMS-based gyroscope including: a sensor frame disposed parallel to a bottom wafer substrate; a sensor mass body which relatively moves to the sensor frame, and is excited at one degree of freedom in an excitation mode; and at least one sensing electrode which senses displacement of the sensor mass body at the one degree of freedom in a sensing mode by Coriolis force, when an external angular velocity is input to the sensor mass body, wherein the sensor mass body includes two mass units, the two mass units are arranged in line symmetry with each other, and the antiphase motion of the two mass units is maintained by an antiphase link mechanism directly or indirectly connected between the two mass units.
    Type: Application
    Filed: November 9, 2017
    Publication date: May 17, 2018
    Applicant: SHIN SUNG C&T CO., LTD.
    Inventors: Ci Moo SONG, Keun Jung YOUN, Jeong Sik KANG, Yong Kook KIM, Seung Ho HAN, Hyun Ju SONG