Abstract: A method of and apparatus for forming chamfers in an orifice of a workpiece. The orifice has an axis, which extends between a first surface and second surface of the workpiece, where the first and second surfaces are parallel to each other. The chamfers are disposed between the first surface and the second surface. The method includes forming an orifice in a workpiece with a source of non-collimated light directed at the workpiece at a predetermined first time interval, and forming a chamfer with a source of collimated light at a second time interval simultaneously with the first time interval. The apparatus includes at least a source of collimated and non-collimated light, a collimated light filter, and a non-collimated light generating arrangement, and at least one shutter and at least one iris that direct collimated and non-collimated light at the workpiece to form the orifice. The apparatus is configured such that the orifice has a surface roughness of between approximately 0.

Abstract: A method of and apparatus for forming chamfers in an orifice of a workpiece. The orifice has an axis, which extends between a first surface and second surface of the workpiece, where the first and second surfaces are parallel to each other. The chamfers are disposed between the first surface and the second surface. The method includes forming an orifice in a workpiece with a source of non-collimated light directed at the workpiece at a predetermined first time interval, and forming a chamfer with a source of collimated light at a second time interval simultaneously with the first time interval. The apparatus includes at least a source of collimated and non-collimated light, a collimated light filter, and a non-collimated light generating arrangement, and at least one shutter and at least one iris that direct collimated and non-collimated light at the workpiece to form the orifice. The apparatus is configured such that the orifice has a surface roughness of between approximately 0.

Abstract: The present invention provides a “solid” diamond, i.e. greater than 5&mgr; thick, electron emitter that has been “machined” using non-contact techniques to a point having a radius of less than about 100&mgr;, preferably below about 10&mgr; and most preferably between about 3 angstroms and about 3&mgr;. The solid diamond electron emitters of the present invention can perform, even at these small radii, as multi-point emitters depending upon the radius and roughness of the pointed tip and can be used in arrays to obtain relatively large area field emitters for applications where such larger field emissions are necessary. Production of the solid diamond emitters of the present invention is preferably accomplished using non-contact electron or ion beam machining techniques. Residual gas analyzers (RGA) and field emitter extractor gauge analyzers (FERGA) that use the solid diamond emitters are also described.