Patents by Inventor Moon-Bo Sim

Moon-Bo Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for testing standby current of semiconductor package
    Patent number: 7368933
    Abstract: A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chips, and storing the measured values of standby current in a database, by using a wafer tester; recognizing a wafer run number of each of semiconductor packages to be tested; downloading measured values of standby current of semiconductor chips corresponding to the recognized wafer run number from the database to a semiconductor package tester; extracting a boundary value defining predetermined upper values of the downloaded measured values of standby current, by using the semiconductor package tester; setting the boundary value as a standby current limit of a program for testing the semiconductor packages by use of the semiconductor package tester; and testing the semiconductor packages based on the standby current limit.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: May 6, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-Bo Sim, Joo-Seok Kwak, Seong-Su Kim, Yun-Bo Yang, Sun-Ki Kim
  • Method for testing standby current of semiconductor package
    Publication number: 20060158205
    Abstract: A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chips, and storing the measured values of standby current in a database, by using a wafer tester; recognizing a wafer run number of each of semiconductor packages to be tested; downloading measured values of standby current of semiconductor chips corresponding to the recognized wafer run number from the database to a semiconductor package tester; extracting a boundary value defining predetermined upper values of the downloaded measured values of standby current, by using the semiconductor package tester; setting the boundary value as a standby current limit of a program for testing the semiconductor packages by use of the semiconductor package tester; and testing the semiconductor packages based on the standby current limit.
    Type: Application
    Filed: January 18, 2006
    Publication date: July 20, 2006
    Inventors: Moon-Bo Sim, Joo-Seok Kwak, Seong-Su Kim, Yun-Bo Yang, Sun-Ki Kim