Abstract: Provided is an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device comprising the same. The encapsulation film comprises an encapsulation layer comprising a moisture adsorbent, and a metal mesh layer formed on the encapsulation layer.

Abstract: Provided is an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device comprising the same. The encapsulation film comprises an encapsulation layer comprising a moisture adsorbent, and a metal mesh layer formed on the encapsulation layer.

Abstract: The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can effectively release heat accumulated inside the organic electronic device and prevent occurrence of bright spots of the organic electronic device.

Abstract: The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can effectively release heat accumulated inside the organic electronic device and prevent occurrence of bright spots of the organic electronic device.

Abstract: The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can effectively release heat accumulated inside the organic electronic device and prevent occurrence of bright spots of the organic electronic device.

Abstract: A ROM repair circuit comprising a ROM cell array having a plurality of cells, each of the cells storing information inputted through a corresponding one of a plurality of bit lines under a control of data inputted through a corresponding one of a plurality of word lines, column and row address detectors for detecting column and row addresses corresponding to a failed one of the cells in the ROM cell array from addresses applied in a test mode and generating error detect signals in accordance with the detected results, respectively, and column and row address converters responsive to the error detect signals from the column and row address detectors to replace the column and row addresses corresponding to the failed one of the cells in the ROM cell array with different column and row addresses corresponding to a different one of the cells in the ROM cell array in which is stored the same information as normal information stored in the failed cell prior to the failure.