Abstract: A plywood laminate having dimensional stability and resistance to warping and delamination is formed from a plurality of higher quality plies and a plurality of lower quality plies. The higher quality plies may be of hardwood and the lower quality plies may be of softwood or lower quality hardwoods, or the higher quality plies may have a veneer grade of better than ANSI/HPVA HP-1-2000 veneer grade C and the lower quality plies may have a veneer grade of no greater than ANSI/HPVA HP-1-2000 veneer grade C. The exposed plies are of the higher quality. In most embodiments, at least two adjacent interior plies are of the lower quality. In those embodiments having a tongue and groove or click-lock edge configuration, the tongue comprises portions of at least two plies and at least one of the plies is a higher quality ply.

Abstract: A method for transporting semiconductor wafers in semiconductor factory automation system, includes the steps of: a) processing a lot of semiconductor wafers to be contained in a semiconductor wafer cassette in a process equipment; b) sending a cassette transportation request from the process equipment to a cell management server when the process equipment has processed the lot of semiconductor wafers; c) generating a transportation instruction in response to the cassette transportation request; and d) if the semiconductor wafer cassette is transported from the process equipment to a stocker by an automatic guide vehicle (AGV), simultaneously activating the AGV and the stocker by simultaneously sending the transportation instruction to the AGV and the stocker. The method in accordance with the present invention can reduce a time taken to transport the semiconductor wafers.