Patents by Inventor Moongil JUNG

Moongil JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230005828
    Abstract: A semiconductor package includes a semiconductor chip; and a redistribution substrate connected to the semiconductor chip, the redistribution structure including a conductive structure including a lower conductive pattern and a redistribution structure on the lower conductive pattern and electrically connected to the lower conductive pattern, an insulating structure covering at least a side surface of the lower conductive pattern or a side surface of the redistribution structure, and a protective layer between the insulating structure and at least one of the lower conductive pattern or the redistribution structure. The protective layer including a first protective layer in contact with at least one of a side surface of the lower conductive pattern or a side surface of the redistribution structure, and a second protective layer in contact with at least a portion of a side surface of the first protective layer.
    Type: Application
    Filed: March 14, 2022
    Publication date: January 5, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Moongil JUNG, Suhyeon KU, Soyoen PARK, Kyungsub KIM