Abstract: Provided is an airflow control system and airflow control method capable of preventing the inflow of foreign, the airflow control system including at least one grating panel mounted on a floor of a clean room and including a plurality of through holes, a semiconductor manufacturing equipment spaced apart from the grating panel by a gap space by using supports or legs, and including a fan mounted toward the grating panel, and a negative pressure preventer for preventing a negative pressure locally formed in the gap space due to a pressure difference between an outer downward airflow flowing along sides of the semiconductor manufacturing equipment and expelled to an outside through the through holes of the grating panel, and an inner downward airflow flowing from the semiconductor manufacturing equipment to the grating panel by the fan and expelled to the outside through the through holes of the grating panel.

Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.

Abstract: An apparatus for treating a substrate includes an index module and a treatment module that treats the substrate. The index module includes a load port on which a carrier having a plurality of substrates received therein is loaded and a transfer frame that is disposed between the treatment module and the load port and that transfers the substrate between the carrier loaded on the load port and the treatment module. The treatment module includes one or more process chambers and a transfer chamber that transfers the substrate to the process chambers. The transfer chamber includes a housing having a transfer space in which the substrate is transferred, a transfer robot that is disposed in the housing and that transfers the substrate between the process chambers, and an electrostatic pad that is provided in the transfer space and that electro-statically attracts particles in the housing.

Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.

Abstract: An embodiment of the inventive concept provides an apparatus for treating a substrate. The apparatus for treating a substrate includes a chamber having a treating space inside the chamber and a gas inlet unit entering a gas into the treating space. The gas inlet unit includes an introduction pipe through which the gas is entered, and a discharging plate in which a discharging hole discharging the gas entered through the introduction pipe is formed. The discharging hole is arranged such that density for each area of the discharging plate is different.

Abstract: An apparatus for treating a substrate includes an index module and a treatment module that treats the substrate. The index module includes a load port on which a carrier having a plurality of substrates received therein is loaded and a transfer frame that is disposed between the treatment module and the load port and that transfers the substrate between the carrier loaded on the load port and the treatment module. The treatment module includes one or more process chambers and a transfer chamber that transfers the substrate to the process chambers. The transfer chamber includes a housing having a transfer space in which the substrate is transferred, a transfer robot that is disposed in the housing and that transfers the substrate between the process chambers, and an electrostatic pad that is provided in the transfer space and that electro-statically attracts particles in the housing.