Patents by Inventor Moon-II Kim

Moon-II Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200303314
    Abstract: A semiconductor package includes a semiconductor chip having connection pads on one surface thereof, a first encapsulant covering at least portions of the semiconductor chip, and a connection structure disposed on the one surface of the semiconductor chip and including one or more redistribution layers electrically connected to the connection pads. A wiring structure is disposed on one surface of the first encapsulant opposing another surface of the first encapsulant facing towards the connection structure. The wiring structure has a passive component embedded therein, and includes one or more wiring layers electrically connected to the passive component. The one or more redistribution layers and the one or more wiring layers are electrically connected to each other.
    Type: Application
    Filed: May 16, 2019
    Publication date: September 24, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myung Sam KANG, Yong Jin PARK, Young Gwan KO, Moon II KIM
  • Patent number: 10461391
    Abstract: An expanded waveguide for providing uniform electromagnetic field is disclosed. The expanded waveguide comprises an expanded area expanded in the direction of the E-plane, an input transition area and an output transition area connected to both sides of the expanded area and configured to pass an electromagnetic wave, and entrance parts formed respectively to an end part of the input transition area and an end part of the output transition area, the electromagnetic wave being inputted and outputted through the entrance parts. Here, a plurality of multilateral pillars are arranged in constant space in the transition areas, and a channel is formed along between the multilateral pillars.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: October 29, 2019
    Assignee: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Moon II Kim, Chang Hwan Yi
  • Publication number: 20150246088
    Abstract: Disclosed are a pharmaceutical composition for treating diabetes and its complications, containing a Quamoclit angulata extract, and more particularly to a Quamoclit angulata extract, a pharmaceutical composition for preventing or treating diabetes and its complications, a pharmaceutical composition for preventing or delaying aging, and a pharmaceutical composition for preventing or treating cancer, which contain the Quamoclit angulata extract. The compositions of the invention exhibit excellent effects on blood glucose lowering, promotion of insulin secretion, reduction of proteinuria, and reduction of lenticular opacity. Thus, the pharmaceutical compositions have excellent effects on the prevention or treatment of diabetes and its complications.
    Type: Application
    Filed: May 14, 2015
    Publication date: September 3, 2015
    Applicant: KOREA RESEARCH INSTITUTE OF BIOSCIENCE AND BIOTECHNOLOGY
    Inventors: Bong Hyun CHUNG, Moon II KIM, So Yeon YI, Ui Jin LEE, Kyoungsook PARK, Pan Kee BAE
  • Publication number: 20140151100
    Abstract: An electronic component embedded printed circuit board includes a core having a cavity; an electronic component inserted in the cavity; insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component; and circuit patterns provided on the insulating layers.
    Type: Application
    Filed: November 27, 2013
    Publication date: June 5, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yeon Seop YU, Moon II Kim, Jun Young Kim
  • Publication number: 20130042472
    Abstract: A method of manufacturing a printed circuit board having embedded electronic components, the method including: mounting a first electronic component on one side of a core sheet and mounting a second electric component on the other side of the core sheet such that the second electronic component overlaps the first electronic component; stacking a first insulation layer on one side of the core sheet such that the first insulation layer covers the first electronic component and stacking a second insulation layer on the other side of the core sheet such that the second insulation layer covers the second electronic component; and forming a circuit pattern on a surface of the first insulation layer or the second insulation layer.
    Type: Application
    Filed: September 14, 2012
    Publication date: February 21, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Doo-Hwan LEE, Byoung-Youl MIN, Myung-Sam KANG, Moon-II KIM, Hyung-Tae KIM
  • Publication number: 20130004596
    Abstract: The present invention relates to a pharmaceutical composition for treating diabetes and its complications, containing a Quamoclit angulata extract, and more particularly to a Quamoclit angulata extract, a pharmaceutical composition for preventing or treating diabetes and its complications, a pharmaceutical composition for preventing or delaying aging, and a pharmaceutical composition for preventing or treating cancer, which contain the Quamoclit angulata extract. The compositions of the invention exhibit excellent effects on blood glucose lowering, promotion of insulin secretion, reduction of proteinuria, and reduction of lenticular opacity. Thus, the pharmaceutical compositions have excellent effects on the prevention or treatment of diabetes and its complications.
    Type: Application
    Filed: February 21, 2011
    Publication date: January 3, 2013
    Applicant: KOREA RESEARCH INSTITUTE OF BIOSCIENCE AND BIOTECHNOLOGY
    Inventors: Bong Hyun Chung, Moon II Kim, So Yeon Yi, Uii Jin Lee, Kyoungsook Park, Pan Kee Bae
  • Publication number: 20110141711
    Abstract: An electronic component embedded printed circuit board and a method of manufacture the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a dielectric core substrate, which has a cavity formed therein, an electronic component, which is housed in the cavity and has an electrode formed on one surface thereof, an insulation layer, which is formed on both surface of the dielectric core substrate, a via, which is formed in the insulation layer such that the via is electrically connected to the electrode, and a first circuit pattern, which is formed on the insulation layer such that the first circuit pattern is electrically connected to the via.
    Type: Application
    Filed: December 14, 2010
    Publication date: June 16, 2011
    Inventors: Seung-Hyun SOHN, Yul-Kyo Chung, Dae-Jung Byun, Moon-II Kim
  • Patent number: 7108788
    Abstract: Disclosed is an on-site treatment method of food waste generated from multi-unit dwellings and institutional food service facilities, by transporting wastewater-containing food waste to a separation chamber by use of domestic wastewater or an additional transporter; separating the transported food waste to wastewater and food waste; and treating the separated wastewater in a sewage disposal plant, and the separated food waste using disposal equipment. Such food waste can be treated even using disposal equipment of small capacities, due to separation of wastewater and food waste, compared to disposal equipment of large capacities required for treating wastewater and food waste together. Also, the quality of the separated wastewater is better than the conventional quality of wastewater, and thus loads of the sewage disposal plant can be efficiently decreased.
    Type: Grant
    Filed: August 29, 2002
    Date of Patent: September 19, 2006
    Assignees: E1 Biotech Co., Ltd., Korean Advanced Institute of Science and Technology
    Inventors: Ho Nam Chang, Do-Yun Kim, Moon-II Kim, Chul-Hee Ryu, Woo-Gi Lee