Abstract: A method and an apparatus for inspecting a substrate are provided. The method includes irradiating light to a semiconductor device formed on a substrate and detecting light reflected from the semiconductor device in order to inspect a defect of the semiconductor device. An irradiation position of the light may gradually move from a semiconductor device formed at the center of the substrate to a semiconductor device formed on an edge of the substrate. at least one semiconductor device formed on a substrate, a light irradiating member which irradiates light onto the semiconductor surface formed on the substrate; a light detecting member which detects light reflected from the semiconductor device in order to inspect the semiconductor device for defects; and an irradiation position of the light gradually moves from a semiconductor device formed at the center of the substrate to a semiconductor device formed on an edge of the substrate.

Abstract: Provided are systems and methods for electronic receipt management using a user terminal which includes an electronic wallet where payment information is stored, an electronic receipt application storing and managing an electronic receipt, an installation number generated to determine what number of application is installed when the electronic receipt application is installed, a dongle including a payment request relay unit requesting an installation number and payment information to the user terminal to transfer received installation number, payment information, and the amount of requested payment to a payment server, a payment unit making a payment using the payment information and the amount of requested payment received from the payment request relay unit and an electronic receipt issuing unit issuing an electronic receipt when the payment unit makes a payment and transferring the issued electronic receipt and the installation number received from the payment request relay unit to an electronic receipt se

Abstract: A method and an apparatus for inspecting a substrate are provided. The method includes irradiating light to a semiconductor device formed on a substrate and detecting light reflected from the semiconductor device in order to inspect a defect of the semiconductor device. An irradiation position of the light may gradually move from a semiconductor device formed at the center of the substrate to a semiconductor device formed on an edge of the substrate. at least one semiconductor device formed on a substrate, a light irradiating member which irradiates light onto the semiconductor surface formed on the substrate; a light detecting member which detects light reflected from the semiconductor device in order to inspect the semiconductor device for defects; and an irradiation position of the light gradually moves from a semiconductor device formed at the center of the substrate to a semiconductor device formed on an edge of the substrate.