Patents by Inventor Moon Sub KIM

Moon Sub KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964925
    Abstract: Provided is a method for preparing an oligomer including: supplying a monomer stream and a solvent stream to a reactor to perform an oligomerization reaction to prepare a reaction product; supplying a discharge stream from the reactor including the reaction product to a separation device and supplying a lower discharge stream from the separation device to a settling tank; adding an organic flocculant to the settling tank to settle and remove a polymer and supplying the lower discharge stream from the separation device from which the polymer is removed to a high boiling point separation column; and removing a high boiling point material from the lower portion in the high boiling point separation column and supplying an upper discharge stream including an oligomer to a solvent separation column.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: April 23, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Kyung Seog Youk, Jong Hun Song, Min Ho Sun, Hong Min Lee, Hyun Seok Kim, Moon Sub Hwang, Jeong Seok Lee
  • Patent number: 11482653
    Abstract: A light emitting diode apparatus is provided. The light emitting diode apparatus includes a wavelength conversion layer, a light emitting diode layer, a light transmission layer, and a sheath layer. The wavelength conversion layer has a first refractive index. The light emitting diode layer includes a base layer arranged on the wavelength conversion layer, and a light emitting structure layer arranged on the base layer. The light transmission layer is arranged on the wavelength conversion layer, surrounds a sidewall of the light emitting diode layer and contacts the sidewall of the light emitting diode layer, and has a second refractive index. The sheath layer is arranged to cover the light emitting diode layer and the light transmission layer, and has a third refractive index less than the second refractive index.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: October 25, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Kuk Lee, Dae Young Lee, Moon Sub Kim, Sung Jin Ahn, Seung Hwan Lee, Dong Kyun Yim, Woo Seok Jang
  • Patent number: 10644205
    Abstract: A light-emitting diode (LED) package includes: an LED having a polygonal shape in a plan view; a light-transmissive layer directing light from the LED in an upward direction; a wavelength conversion layer changing a wavelength of the light emitted through the light-transmissive layer; and a coating layer covering the light-transmissive layer and reflecting the light emitted through the light-transmissive layer in the upward direction. In a plan view of the light-transmissive layer, a length from a first point corresponding to a vertex of the LED to a second point corresponding to an end of an extension of a diagonal of the LED is greater than or equal to a length from the first point to a third point corresponding to an end of an extension of a side of the LED.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: May 5, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-kuk Lee, Moon-sub Kim, Sung-jin Ahn, Suk-ho Yoon, Seung-hwan Lee
  • Publication number: 20190371988
    Abstract: A light emitting diode apparatus is provided. The light emitting diode apparatus includes a wavelength conversion layer, a light emitting diode layer, a light transmission layer, and a sheath layer. The wavelength conversion layer has a first refractive index. The light emitting diode layer includes a base layer arranged on the wavelength conversion layer, and a light emitting structure layer arranged on the base layer. The light transmission layer is arranged on the wavelength conversion layer, surrounds a sidewall of the light emitting diode layer and contacts the sidewall of the light emitting diode layer, and has a second refractive index. The sheath layer is arranged to cover the light emitting diode layer and the light transmission layer, and has a third refractive index less than the second refractive index.
    Type: Application
    Filed: January 31, 2019
    Publication date: December 5, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Kuk LEE, Dae Young LEE, Moon Sub KIM, Sung Jin AHN, Seung Hwan LEE, Dong Kyun YIM, Woo Seok JANG
  • Publication number: 20190280162
    Abstract: A light-emitting diode (LED) package includes: an LED having a polygonal shape in a plan view; a light-transmissive layer directing light from the LED in an upward direction; a wavelength conversion layer changing a wavelength of the light emitted through the light-transmissive layer; and a coating layer covering the light-transmissive layer and reflecting the light emitted through the light-transmissive layer in the upward direction. In a plan view of the light-transmissive layer, a length from a first point corresponding to a vertex of the LED to a second point corresponding to an end of an extension of a diagonal of the LED is greater than or equal to a length from the first point to a third point corresponding to an end of an extension of a side of the LED.
    Type: Application
    Filed: September 12, 2018
    Publication date: September 12, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-kuk LEE, Moon-sub KIM, Sung-jin AHN, Suk-ho YOON, Seung-hwan LEE
  • Patent number: 9646956
    Abstract: Embodiments provide a light emitting device package including a package body having a top-opened cavity disposed in at least a portion thereof, a first electrode layer and a second electrode layer electrically isolated from the package body with an insulating layer interposed therebetween, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity, a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity, and a sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: May 9, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Bum Chul Cho, Moon Sub Kim, Jin Kwan Kim
  • Publication number: 20150249074
    Abstract: Embodiments provide a light emitting device package including a package body having a top-opened cavity disposed in at least a portion thereof, a first electrode layer and a second electrode layer electrically isolated from the package body with an insulating layer interposed therebetween, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity, a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity, and a sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device.
    Type: Application
    Filed: May 14, 2015
    Publication date: September 3, 2015
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Bum Chul CHO, Moon Sub KIM, Jin Kwan KIM
  • Patent number: 9064773
    Abstract: Embodiments provide a light emitting device package including a package body having a top-opened cavity disposed in at least a portion thereof, a first electrode layer and a second electrode layer electrically isolated from the package body with an insulating layer interposed therebetween, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity, a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity, and a sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: June 23, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Bum Chul Cho, Moon Sub Kim, Jin Kwan Kim
  • Publication number: 20140117357
    Abstract: Embodiments provide a light emitting device package including a package body having a top-opened cavity disposed in at least a portion thereof, a first electrode layer and a second electrode layer electrically isolated from the package body with an insulating layer interposed therebetween, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity, a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity, and a sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device.
    Type: Application
    Filed: March 15, 2013
    Publication date: May 1, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Bum Chul CHO, Moon Sub KIM, Jin Kwan KIM