Patents by Inventor Moon-chul Lee
Moon-chul Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8894477Abstract: A display device including a case having a transparent window that forms one side of a first air flow path, a display unit including a display surface that faces the transparent window to form the other side of the first air flow path, a ventilator to supply air to the first air flow path, and a diffuser disposed at an exit of the first air flow path and having a cross-sectional area that is gradually increased.Type: GrantFiled: November 30, 2010Date of Patent: November 25, 2014Assignees: Samsung Electronics Co., Ltd., Hongik Industry-Academia Cooperation FoundationInventors: Yong-soo Lee, Min-soo Kim, Seung-won Shin, Ha-seung Chung, Moon-chul Lee
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Patent number: 8474937Abstract: Provided are an apparatus and method of controlling jetting of ink of an inkjet printer. The apparatus includes at least one print head chip, which includes a temperature sensor for sensing the temperature of the print head chip and a voltage controlled oscillator (VCO) for converting the sensed temperature to a frequency component. The apparatus may also include a counter, which converts the frequency component to a code information using a reference frequency component, and a controller, which controls the ink jetting operation of the at least one print head chip based on the code information and/or the frequency component.Type: GrantFiled: February 9, 2009Date of Patent: July 2, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Yong-Won Jeong, Hyung Choi, Yong-Seop Yoon, Moon-Chul Lee, Dong-Shik Shim
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Patent number: 8419158Abstract: An apparatus to sense the temperature of an ink-jet head includes at least one or more CMOS (complementary metal oxide semiconductor) lateral BJTs (bipolar junction transistors) to sense the temperature of the ink-jet head, and a current supply unit to supply a current to the CMOS lateral BJTs. Minimum sized CMOS lateral BJTs are applied to an ink-jet printer head so that precise temperature control can be performed in a shuttle or array type ink-jet printer.Type: GrantFiled: June 16, 2008Date of Patent: April 16, 2013Assignee: SAMSUNG Electronics Co., Ltd.Inventors: Yong-won Jeong, Hyung Choi, Eun-bong Han, Yong-seop Yoon, Moon-chul Lee, Dong-sik Shim
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Patent number: 8349199Abstract: An ink feedhole of an inkjet printhead and a method of forming the same includes an ink feedhole that penetrates a substrate and has a width that narrows in an upper direction of the substrate, wherein at least one internal wall of the ink feedhole has a plurality of steps and inclines with respect to a surface of the substrate.Type: GrantFiled: August 20, 2009Date of Patent: January 8, 2013Assignee: SAMSUNG Electronics Co., Ltd.Inventors: Yong-won Jeong, Yong-seop Yoon, Moon-chul Lee, Dong-sik Shim, Jong-seok Kim
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Patent number: 8254121Abstract: A cooler and a display device including the cooler. The cooler includes: a housing; an air blowing unit disposed inside the housing and sucking external air and blowing the external air in the housing, wherein the air blowing unit includes a plurality of groups each including two air blowers; a guide vane disposed above the air blowing unit and to guide air flowed out from the air blowing unit to flow in different directions; and a plurality of auxiliary guide vanes disposed between the air blowing unit and the guide vane, and each disposed in each of the groups each including two air blowers, so as to guide air flowing below the air blowing unit to flow toward the guide vane.Type: GrantFiled: August 25, 2010Date of Patent: August 28, 2012Assignee: Samsung Electronics Co., LtdInventors: Moon-chul Lee, Min-soo Kim, Yong-soo Lee, Sru Kim
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Patent number: 8216482Abstract: A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole.Type: GrantFiled: April 23, 2009Date of Patent: July 10, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Jong-Seok Kim, Yong-Seop Yoon, Moon-Chul Lee, Yong-Won Jeong, Dong-Sik Shim, Hyung Choi
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Patent number: 8114578Abstract: Provided are a method of manufacturing a photosensitive epoxy structure using a photolithograph process, and a method of manufacturing an inkjet printhead using the method of manufacturing a photosensitive epoxy structure. The method of manufacturing the photosensitive epoxy structure includes forming an epoxy material layer formed of photosensitive epoxy; forming a first exposure pattern in the epoxy material layer by performing a first exposure operation; forming a second exposure pattern in the non-exposed portions of the epoxy material layer by performing a second exposure operation; and developing the epoxy material layer, wherein the amount of first UV energy used in the first exposure operation is different from the amount of second UV energy used in the second exposure operation.Type: GrantFiled: January 3, 2008Date of Patent: February 14, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Moon-chul Lee, Yong-seop Yoon, Min-soo Kim, Yong-won Jeong, Dong-sik Shim
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Patent number: 8109609Abstract: Disclosed are an ink ejecting device and a method of manufacturing the same. The disclosed ink ejecting device includes an inkjet head including a substrate, which includes an ink feed hole, a plurality of via holes, which are formed in the rear surface of the substrate, and which expose the ink feed holes therethtough, a chamber layer stacked on the substrate, and a nozzle layer stacked on the chamber layer, and includes a base header, which is attached to the inkjet head and includes a plurality of ink supply slots having a corresponding arrangement with respect to the via holes.Type: GrantFiled: April 2, 2009Date of Patent: February 7, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Dong-Sik Shim, Yong-Seop Yoon, Bang-Weon Lee, Moon-Chul Lee, Yong-Won Jeong, Jong-Seok Kim
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Patent number: 8066356Abstract: A thermal inkjet printhead is provided including a substrate, and a chamber layer, which is stacked on the substrate. The chamber layer includes an ink chamber that is filled with ink supplied from an ink feed hole. The printhead includes a heater inside the ink chamber that heats the ink, an island, which is formed on the substrate at an ink inlet port of the ink chamber, and a nozzle layer, which is stacked on the chamber layer, including a nozzle for ejecting the ink. The walls of the ink chamber and the island that face each other are symmetrical with respect to the center of the nozzle.Type: GrantFiled: September 12, 2008Date of Patent: November 29, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Moon-chul Lee, Yong-seop Yoon, Yong-won Jeong, Dong-sik Shim, Sung-joon Park, Jong-seok Kim
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Patent number: 8057013Abstract: An inkjet printhead and a method of manufacturing the printhead. The inkjet printhead includes a substrate through which an ink supply passage is formed, a chamber plate stacked on the substrate having an ink chamber filled with ink supplied through the ink supply passage and heating resistors to heat the ink formed in the ink chamber, a nozzle plate formed on the chamber plate and through which a plurality of nozzles through which ink is ejected are formed, and a water repellent layer formed on the nozzle plate, wherein portions of a covalent bond formed by reaction between the material forming the nozzle plate and a hydrolysis material used to form the water repellent layer are discontinuously formed.Type: GrantFiled: July 30, 2007Date of Patent: November 15, 2011Assignee: SAMSUNG Electronics Co., Ltd.Inventors: Myong-jong Kwon, Sung-joon Park, Moon-chul Lee
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Publication number: 20110167845Abstract: A cooler and a display device including the cooler. The cooler includes: a housing; an air blowing unit disposed inside the housing and sucking external air and blowing the external air in the housing, wherein the air blowing unit includes a plurality of groups each including two air blowers; a guide vane disposed above the air blowing unit and to guide air flowed out from the air blowing unit to flow in different directions; and a plurality of auxiliary guide vanes disposed between the air blowing unit and the guide vane, and each disposed in each of the groups each including two air blowers, so as to guide air flowing below the air blowing unit to flow toward the guide vane.Type: ApplicationFiled: August 25, 2010Publication date: July 14, 2011Applicant: Samsung Electronics Co., LtdInventors: Moon-chul LEE, Min-soo Kim, Yong-soo Lee, Sru Kim
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Publication number: 20110162831Abstract: A display device including a case having a transparent window that forms one side of a first air flow path, a display unit including a display surface that faces the transparent window to form the other side of the first air flow path, a ventilator to supply air to the first air flow path, and a diffuser disposed at an exit of the first air flow path and having a cross-sectional area that is gradually increased.Type: ApplicationFiled: November 30, 2010Publication date: July 7, 2011Inventors: Yong-soo LEE, Min-soo KIM, Seung-won SHIN, Ha-seung CHUNG, Moon-chul LEE
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Patent number: 7963021Abstract: An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.Type: GrantFiled: February 8, 2008Date of Patent: June 21, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Moon-chul Lee, Jong-oh Kwon, Woon-bae Kim, Jea-shik Shin, Jun-sik Hwang, Eun-sung Lee
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Patent number: 7939909Abstract: An LC device having a substrate, a support layer having upper and lower sides formed on the substrate, inductors formed on either the upper or lower side of the support layer, and capacitors formed in the opposite side of the support layer. The support layer may be formed of a low-k dielectric material, and a connection portion may be provided to connect the inductors and capacitors in the support layer. The inductors and capacitors are disposed in a stacked structure on the upper and lower sides of the low-k dielectric support layer on the substrate, so that space efficiency may be maximized on the substrate. The low-k dielectric support layer provides support between the inductors and capacitors so that substrate loss is minimized and a Q factor of the inductors is enhanced.Type: GrantFiled: January 22, 2007Date of Patent: May 10, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Moon-chul Lee, In-sang Song, Young-tack Hong, Sung-hye Jeong, Jeong-yoo Hong, Byung-yoo Hong
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Patent number: 7926165Abstract: A method of manufacturing a micro antenna is provided. The method includes forming a plurality of holes penetrating a first substrate, filling each of the plurality of holes with a conductive material to form a plurality of vertical conducting parts, forming a plurality of horizontal conducting parts on each of two different surfaces of the first substrate, wherein the each of the horizontal conducting parts is electrically connected to the corresponding vertical conducting parts, bonding the first substrate, on which the vertical conducting parts and the horizontal conducting parts have been formed, to a second substrate, and removing the first substrate to expose a whole structure of a 3D micro antenna which is formed on the second substrate and includes the vertical conducting parts and the horizontal conducting parts connected to each other.Type: GrantFiled: March 1, 2007Date of Patent: April 19, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Young-tack Hong, Moon-chul Lee, In-sang Song, Sang-wook Kwon, Chang-won Jung, Eun-seok Park
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Patent number: 7896621Abstract: Provided is a micro pump having a simple structure. The micro pump includes a pump chamber including inflow and outflow passages through which a drive fluid flows, a first valve configured to open or close the inflow passage, a second valve configured to open or close the outflow passage, and a pump chamber heating and cooling unit configured to heat or cool the pump chamber.Type: GrantFiled: November 4, 2005Date of Patent: March 1, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Tae-sik Park, Young-il Kim, Jung-ho Kang, Moon-chul Lee
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Publication number: 20110020140Abstract: Provided is a micro pump having a simple structure. The micro pump includes a pump chamber including inflow and outflow passages through which a drive fluid flows, a first valve configured to open or close the inflow passage, a second valve configured to open or close the outflow passage, and a pump chamber heating and cooling unit configured to heat or cool the pump chamber.Type: ApplicationFiled: November 4, 2005Publication date: January 27, 2011Inventors: Tae-sik Park, Young-il Kim, Jung-ho Kang, Moon-chul Lee
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Patent number: 7862150Abstract: The inkjet printhead includes substrate having an ink feed hole formed to supply ink, a chamber layer stacked on the substrate, and including a plurality of main ink chambers formed therein with the ink feed hole therebetween and a plurality of compensation ink chambers formed therein between the main ink chambers that face each other; and a nozzle layer stacked on the chamber layer, and including a plurality of main nozzles corresponding to the main ink chambers and a plurality of compensation nozzles corresponding to the compensation ink chambers.Type: GrantFiled: September 24, 2007Date of Patent: January 4, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Moon-chul Lee, Myong-jong Kwon, Yong-seop Yoon, Jin-wook Lee, Yong-won Jeong, Donk-sik Shim
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Patent number: 7810911Abstract: A thermal inkjet printhead includes a plurality of bonding pads to which an external voltage is applied, a plurality of common wires connected to the each of the bonding pads, respectively, a plurality of individual wires connected to each of the common wires, respectively, and heaters connected to each of the individual wires, respectively, to generate ink bubbles by heating ink, wherein each of the common wires includes a first metal layer and a first metal bump which are formed on the first metal layer.Type: GrantFiled: May 1, 2007Date of Patent: October 12, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Dong-sik Shim, Yong-seop Yoon, Moon-chul Lee, Yong-won Jeong, Hyung Choi
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Patent number: 7795011Abstract: A bio sample processing apparatus and method using vacuum chambers in which a bio sample is injected into a first vacuum chamber connected with one end of a bio processor and, after processing, is ejected into a second vacuum chamber connected with the other end of the bio processor. The vacuum chambers and bio processor are connected with each other to form an environment with a pressure lower than atmospheric pressure, and the bio sample moves toward the second vacuum chamber due to the pressure difference created by the injection of the bio sample into the first vacuum chamber.Type: GrantFiled: July 25, 2005Date of Patent: September 14, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Tae-sik Park, Sung-hee Lee, Jung-ho Kang, Young-il Kim, Moon-chul Lee