Abstract: An injection molded product is provided that does not require any separate processes after the injection molding and on a surface of which a beautiful pattern is formed. The injection molded product includes a highly even surface and an irregular minute prominent surface having a profile having an arithmetic mean deviation higher than an arithmetic mean deviation of a profile of the highly even surface, and on which a pattern is formed by a difference in the arithmetic mean deviation of the profile of the highly even surface and of the irregular minute prominent surface.

Abstract: An injection molded product is provided that does not require any separate processes after the injection molding and has beautiful patterns on a surface thereof. The injection molded product includes an irregular prominent surface on which irregular prominences are formed, a regular prominent surface formed having fan-shaped minute protrusions, and a pattern formed by a difference of a regularity between the irregular prominent surface and the regular prominent surface.

Abstract: Disclosed related to a display device according to the present invention comprising an external housing; a display module accepted into the external housing; and an image signal processing unit supplying image signals to the display module, and the external housing including a regular reflection unit regularly reflecting lights from outside and a diffused reflection unit diffusely reflecting lights from outside. It is advantageous that the normal watching of the screen while the watching of the display device is not disturbed, and that the satisfactory of the users is improved with a predetermined pattern when the display device is not being used. Further, it is also advantageous that the area of gloss may be controlled as controlling the relative area of the regular reflection unit and the diffused reflection unit.

Abstract: Disclosed related to a display device according to the present invention comprising an external housing; a display module accepted into the external housing; and an image signal processing unit supplying image signals to the display module, and the external housing including a regular reflection unit regularly reflecting lights from outside and a diffused reflection unit diffusely reflecting lights from outside. It is advantageous that the normal watching of the screen while the watching of the display device is not disturbed, and that the satisfactory of the users is improved with a predetermined pattern when the display device is not being used. Further, it is also advantageous that the area of gloss may be controlled as controlling the relative area of the regular reflection unit and the diffused reflection unit.

Abstract: Disclosed related to an injection molded product does not require any separate processes after the injection molding and has beautiful patterns on the surface. To achieve the objects above, the present invention provides an injection molded product, comprising: an irregular prominent surface on which irregular prominences are formed; a regular prominent surface formed with fan-shaped minute protrusions; and a pattern formed by the difference of the regularity between the irregular prominent surface and the regular prominent surface.

Abstract: An object of the present invention is to provide an injection molded product on which a pattern beautiful and not required with any separate processes after injection molding is formed on the surface. To achieve the above-mentioned object, the present invention provides an injection molded product, comprising: a highly even surface; and an irregular minute prominent surface of an arithmetic mean deviation of the profile higher than the arithmetic mean deviation of the profile of the highly even surface; and on which a pattern is formed by the difference of the arithmetic mean deviation of the profile between the highly even surface and the irregular minute prominent surface.

Abstract: A method for removing an oxide layer such as a natural oxide layer and a semiconductor manufacturing apparatus which uses the method to remove the oxide layer. A vertically movable susceptor is installed at the lower portion in a processing chamber and a silicon wafer is loaded onto the susceptor when it is at the lower portion of the processing chamber. The air is exhausted from the processing chamber to form a vacuum condition therein. A hydrogen gas in a plasma state and a fluorine-containing gas are supplied into the processing chamber to induce a chemical reaction with the oxide layer on the silicon wafer, resulting in a reaction layer. Then, the susceptor is moved up to the upper portion of the processing chamber, to anneal the silicon wafer on the susceptor with a heater installed at the upper portion of the processing chamber, thus vaporizing the reaction layer. The vaporized reaction layer is exhausted out of the chamber.

Abstract: A cleanling apparatus for removing contaminants from the surface of a substrate includes two parts: one which produces an aerosol including frozen particles and directs the aerosol onto the surface of the substrate to remove contaminants from the surface by physical force, and another part in which a fluid including a gaseous reactant is directed onto the surface of the substrate while the surface is irradiated to cause a chemical reaction between the reactant and organic contaminants on the surface, to chemically removing the organic contaminants. In the method of cleaning the substrate, the physical and chemical cleaning processes are carried out in a separate manner from one another so that the frozen particles of the aerosol are not exposed to the effects of the light used in irradiating the surface of the substrate. Therefore, the effectiveness of the aerosol in cleaning the substrate is maximized.

Abstract: A method for removing an oxide layer such as a natural oxide layer and a semiconductor manufacturing apparatus which uses the method to remove the oxide layer. A vertically movable susceptor is installed at the lower portion in a processing chamber and a silicon wafer is loaded onto the susceptor when it is at the lower portion of the processing chamber. The air is exhausted from the processing chamber to form a vacuum condition therein. A hydrogen gas in a plasma state and a fluorine-containing gas are supplied into the processing chamber to induce a chemical reaction with the oxide layer on the silicon wafer, resulting in a reaction layer. Then, the susceptor is moved up to the upper portion of the processing chamber, to anneal the silicon wafer on the susceptor with a heater installed at the upper portion of the processing chamber, thus vaporizing the reaction layer. The vaporized reaction layer is exhausted out of the chamber.

Abstract: A method of manufacturing a semiconductor device having a storage electrode of a capacitor is provided. The method includes the steps of: forming a contact hole perforating through an interlayer dielectric layer on a semiconductor substrate; forming a conductive plug to fill the contact hole and expose the surface of the interlayer dielectric layer; forming molds on the interlayer dielectric layer to expose the surface of the conductive plug; recessing the upper surface of the conductive plug to expose a portion of the sidewalls of the interlayer dielectric layer; forming an electrode layer to cover the recessed conductive plug, and the sidewalls of the interlayer dielectric layer and the molds; and removing upper surfaces of the electrode layer to make a storage electrode until molds are exposed.

Abstract: A cleanling apparatus for removing contaminants from the surface of a substrate includes two parts: one which produces an aerosol including frozen particles and directs the aerosol onto the surface of the substrate to remove contaminants from the surface by physical force, and another part in which a fluid including a gaseous reactant is directed onto the surface of the substrate while the surface is irradiated to cause a chemical reaction between the reactant and organic contaminants on the surface, to chemically removing the organic contaminants. In the method of cleaning the substrate, the physical and chemical cleaning processes are carried out in a separate manner from one another so that the frozen particles of the aerosol are not exposed to the effects of the light used in irradiating the surface of the substrate. Therefore, the effectiveness of the aerosol in cleaning the substrate is maximized.

Abstract: A cleaning apparatus for removing contaminants from the surface of a substrate includes two parts: one which produces an aerosol including frozen particles and directs the aerosol onto the surface of the substrate to remove contaminants from the surface by physical force, and another part in which a fluid including a gaseous reactant is directed onto the surface of the substrate while the surface is irradiated to cause a chemical reaction between the reactant and organic contaminants on the surface, to chemically removing the organic contaminants. In the method of cleaning the substrate, the physical and chemical cleaning processes are carried out in a separate manner from one another so that the frozen particles of the aerosol are not exposed to the effects of the light used in irradiating the surface of the substrate. Therefore, the effectiveness of the aerosol in cleaning the substrate is maximized.

Abstract: A cleaning apparatus for removing contaminants from the surface of a substrate includes two parts: one which produces an aerosol including frozen particles and directs the aerosol onto the surface of the substrate to remove contaminants from the surface by physical force, and another part in which a fluid including a gaseous reactant is directed onto the surface of the substrate while the surface is irradiated to cause a chemical reaction between the reactant and organic contaminants on the surface, to chemically removing the organic contaminants. In the method of cleaning the substrate, the physical and chemical cleaning processes are carried out in a separate manner from one another so that the frozen particles of the aerosol are not exposed to the effects of the light used in irradiating the surface of the substrate. Therefore, the effectiveness of the aerosol in cleaning the substrate is maximized.

Abstract: A method of manufacturing a semiconductor device having a storage electrode of a capacitor is provided. The method includes the steps of: forming a contact hole perforating through an interlayer dielectric layer on a semiconductor substrate; forming a conductive plug to fill the contact hole and expose the surface of the interlayer dielectric layer; forming molds on the interlayer dielectric layer to expose the surface of the conductive plug; recessing the upper surface of the conductive plug to expose a portion of the sidewalls of the interlayer dielectric layer; forming an electrode layer to cover the recessed conductive plug, and the sidewalls of the interlayer dielectric layer and the molds; and removing upper surfaces of the electrode layer to make a storage electrode until molds are exposed.

Abstract: Cleaning solutions for removing contaminants from integrated circuit substrates comprise fluoroboronic acid and phosphoric acid. Methods of removing contaminants from integrated circuit substrates comprise contacting the substrates with cleaning solutions comprising fluoroboronic acid and phosphoric acid. The integrated circuit substrates are then contacted with aqueous solutions.

Abstract: Disclosed is a method of forming storage cell capacitors for use in dynamic random access memories, which comprises, after sequentially depositing a reaction barrier layer and a platinum layer on top of a contact plug which formed on a semiconductor substrate having a node, wet etching the reaction barrier layer to form lateral recesses underneath edges of the platinum layer, and forming sidewall spacer in the lateral recesses and underneath the platinum layer. Also, according to an another embodiment of the invention, a method comprise two important features, one is to surround sidewalls of a reaction barrier layer with an oxide layer, and the other is to form a platinum layer, serving as a storage node electrode of a capacitor, having an inclined plane of more than 80 degrees. The upper portion of the platinum layer has a steeply-sloped pattern of more than 80.degree.

Abstract: Cleaning solutions for removing contaminants from integrated circuit substrates comprise fluoroboric acid and phosphoric acid. Methods of removing contaminants from integrated circuit substrates comprise contacting the substrates with cleaning solutions comprising fluoroboric acid and phosphoric acid. The integrated circuit substrates are then contacted with aqueous solutions.