Patents by Inventor MoonKi Jeong

MoonKi Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system with package-on-package and method of manufacture thereof
    Patent number: 8432028
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a base substrate top side; mounting a base integrated circuit over the base substrate top side, the base integrated circuit having an active side opposite an inactive side with the inactive side facing the base substrate top side; attaching a peripheral interconnect to the base substrate top side and a device peripheral pad of the base integrated circuit at the active side; mounting an interposer over the base integrated circuit and the peripheral interconnect, the interposer having an interposer top side and a window; and attaching a central interconnect to the interposer top side and a device central pad of the base integrated circuit at the active side, the central interconnect through the window.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: April 30, 2013
    Assignee: STATS ChipPAC Ltd.
    Inventors: JinGwan Kim, KyuWon Lee, MoonKi Jeong, SunYoung Chun, JiHoon Oh
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20120241936
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a base substrate top side; mounting a base integrated circuit over the base substrate top side, the base integrated circuit having an active side opposite an inactive side with the inactive side facing the base substrate top side; attaching a peripheral interconnect to the base substrate top side and a device peripheral pad of the base integrated circuit at the active side; mounting an interposer over the base integrated circuit and the peripheral interconnect, the interposer having an interposer top side and a window; and attaching a central interconnect to the interposer top side and a device central pad of the base integrated circuit at the active side, the central interconnect through the window.
    Type: Application
    Filed: March 21, 2011
    Publication date: September 27, 2012
    Inventors: JinGwan Kim, KyuWon Lee, MoonKi Jeong, SunYoung Chun, JiHoon Oh