Abstract: The apparatus includes a controller for controlling a liquid discharge unit and a support unit, in which the controller controls the support unit and the liquid discharge unit so that a substrate processing operation in which a treatment solution is supplied to the substrate to process the substrate; a substrate unloading operation in which the substrate is unloaded from the processing container after the substrate processing operation; and a container cleaning operation in which the processing container is cleaned after the substrate unloading operation are sequentially performed, and in the container cleaning operation, a primary cleaning is performed by discharging the cleaning solution from a first nozzle to the support unit, and then a secondary cleaning is performed by discharging the antistatic liquid from a second nozzle to the support unit or the processing container.

Abstract: Disclosed is a substrate processing method including: loading a substrate onto a support unit positioned in a processing space of a chamber so that a patterned face of the substrate faces down; and rotating the substrate loaded onto the support unit, discharging an etchant for etching a thin film formed on the patterned face onto the patterned face of the substrate, and discharging a heating fluid onto a non-patterned face of the substrate.

Abstract: Disclosed is a substrate processing apparatus including: a support unit for supporting a substrate and rotating the substrate; a solution discharge unit for discharging a processing solution including a first material and a second material onto the substrate to remove a film on the substrate; and a controller for controlling the solution discharge unit, in which the controller sets, when the solution discharge unit discharges the processing solution to a first position and a second position on the substrate, a hydrogen ion concentration of the processing solution discharged to the first position to be different from a hydrogen ion concentration of the processing solution discharged to the second position, and the first position is a center of the substrate or is located closer to the center of the substrate than the second position.

Abstract: A chemical liquid supply unit and a substrate processing apparatus including the same are proposed, which is capable of efficiently removing contaminants in a chemical liquid.

Abstract: According to the disclosed substrate processing apparatus, a first bowl is located to correspond to a substrate, and a first chemical solution supply module supplies a first chemical solution while a support module rotates at a first speed, and a second bowl is located to correspond to the substrate, and a second chemical solution supply module supplies a second chemical solution at a first flow rate while a support module rotates at a second speed equal to or smaller than the first speed, and the second bowl is located to correspond to the substrate, and the second chemical solution supply module does not supply the second chemical solution or supplies the second chemical solution at a second flow rate smaller than the first flow rate while the support module rotates at a third speed smaller than the second speed.

Abstract: According to the disclosed substrate processing apparatus, a first bowl is located to correspond to a substrate, and a first chemical solution supply module supplies a first chemical solution while a support module rotates at a first speed, and a second bowl is located to correspond to the substrate, and a second chemical solution supply module supplies a second chemical solution at a first flow rate while a support module rotates at a second speed equal to or smaller than the first speed, and the second bowl is located to correspond to the substrate, and the second chemical solution supply module does not supply the second chemical solution or supplies the second chemical solution at a second flow rate smaller than the first flow rate while the support module rotates at a third speed smaller than the second speed.

Abstract: A wrap case includes: a case; a support rod which is separably provided inside the case and is formed to be able to support a wrap film roll; and a cutter unit which is provided to the case so as to cut a wrap film which is pulled out to the outside of the case. The cutter unit comprises: a cutter rail which is provided at the outside of the case and elongates in a longitudinal direction of the case; a moving cutter which is connected to the cutter rail to be slidable along the cutter rail; and a mounting/dismounting unit for mounting or dismounting the moving cutter to or from the cutter rail.

Abstract: The present invention provides an apparatus for automatically producing nano-gold or silver ionized water having a simplified structure. Therefore, the apparatus can be easily fabricated with low cost. Since the ionized water is continuously produced using a waterway through which raw water flows, differently from the conventional techniques in which the raw water stays in a reservoir, it is possible to solve problems such as settlement of ionized water, and thus it is possible to produce nano-gold/silver ionized water having a desired concentration of gold/silver ions within a short period of time. As a result, the antibacterial and sterilizing activity which is an intrinsic property of the nano-gold/silver ions is improved, and the thus produced ionized water having strong detergency can be used as antibacterial and sterilizing water.

Abstract: The present invention provides a method for automatically producing nano-gold/silver ionized water, the method including: a raw water supply step in which raw water is filtered by a filter F, passed through a flow control valve V for controlling the amount of raw water, and supplied after the amount of raw water is measured by a flow meter M in real time; a nano-gold/silver ionized water production step in which after the amount of the raw water is measured by the flow meter M, the raw water is passed through a nano-gold/silver ionized water producer P to produce nano-gold/silver ionized water; a control step in which a controller C connected to the nano-gold/silver ionized water producer P controls a microprocessor and a driver, which control the filter F and the flow meter M, a current/voltage driver, and the opening/closing of a valve; and a sensing step in which a sensor I connected to the controller C measures the amount and concentration of ionized water passing through the nano-gold/silver ionized wate