Abstract: A laser bonding device and a laser bonding method are provided. The laser bonding device includes: a stage configured to support a first substrate; a pressure module configured to fix a plurality of elements on the first substrate; a laser irradiator configured to irradiate a laser beam to a conductive bonding pattern located between the first substrate and the plurality of elements; and a mask located on the first substrate and having openings overlapping the plurality of elements, wherein the plurality of elements includes at least one of a light emitting element, an integrated circuit, or a driving circuit, and wherein the laser irradiator is configured to irradiate a laser beam of a first power for a first time period and configured to irradiate a laser beam of a second power higher than the first power for a second time period.

Abstract: A display device, a method for manufacturing a display device, and an electronic device are provided. The display device includes: a substrate having a display area and a non-display area; a pad electrode and a first electrode spaced from each other on the substrate; a first conductive bonding pattern on the pad electrode; a circuit board or an integrated circuit on the first conductive bonding pattern; a second conductive bonding pattern on the first electrode; and a light emitting element on the second conductive bonding pattern and electrically connected to the second conductive bonding pattern, wherein the first conductive bonding pattern and the second conductive bonding pattern include a same material.

Abstract: A display device includes: a pixel electrode located on a substrate; and a light emitting element located on the pixel electrode and electrically connected to the pixel electrode, wherein the light emitting element includes: a semiconductor stack including a first semiconductor layer, an active layer, and a second semiconductor layer; a protective film covering a side surface of the semiconductor stack; and a first contact electrode located on a side surface of the protective film and electrically connected to the first semiconductor layer, wherein the first contact electrode includes a transparent conductive material.

Abstract: A light-emitting element includes a core including a first semiconductor layer including a first portion and a second portion, the first and second portions having side surfaces at different inclinations, a second semiconductor layer disposed on the first semiconductor layer, and an emissive layer disposed between the first semiconductor layer and the second semiconductor layer; a first insulating layer surrounding the first portion of the first semiconductor layer; and a second insulating layer surrounding the second portion of the first semiconductor layer.

Abstract: Provided is a display device including a substrate and a display element layer disposed on the substrate. The display element layer includes an anode electrode and a cathode electrode, a first bonding metal disposed between the anode electrode and the cathode electrode, a first reflective electrode disposed on the anode electrode, a second reflective electrode disposed on the cathode electrode, a light emitting element including a first element electrode, a second element electrode, and a second bonding metal, a first transparent electrode electrically connecting the first reflective electrode and the first element electrode to each other, and a second transparent electrode electrically connecting the second reflective electrode and the second element electrode to each other.

Abstract: Provided is a display device including: a substrate extending in a first direction and a second direction intersecting the first direction and including a display area and a non-display area around the display area; and a display element layer disposed on the substrate in a third direction intersecting the first and second directions, wherein the display element layer includes a bank disposed on the display area of the substrate and having openings; light emitting elements respectively overlapping the openings and at least partially disposed in the openings; and a dam member disposed in the display area along an edge of the display area, and the light emitting elements have a first height in the third direction, and the dam member has a second height greater than the first height in the third direction.

Abstract: Provided is a display device including a substrate; an anode electrode and a cathode electrode on the substrate; an intermediate electrode including a first intermediate electrode disposed on the anode electrode and exposes a portion of the anode electrode, and a second intermediate electrode disposed on the cathode electrode and exposes a portion of the cathode electrode; and a light-emitting element including a first element electrode electrically connected to the anode electrode, and a second element electrode electrically connected to the cathode electrode.

Abstract: A laser bonding device includes: a support unit configured to fix a substrate thereon; a pressurized head module configured to fix a light emitting element as a bonding object; a laser generating unit configured to irradiate a laser beam to a bonding member for bonding the light emitting element and the substrate; a temperature sensor configured to measure the temperature of the bonding member; and a control unit configured to control a power and time of a laser beam irradiated to the light emitting element based on data received from the temperature sensor.

Abstract: A light emitting element includes a bonding electrode, and a light emitting stack including a first semiconductor layer, an active layer, and a second semiconductor layer sequentially disposed each other on the bonding electrode. At least one protrusion structure is defined on an upper surface of the light emitting stack, and the protrusion structure includes a first protrusion protruding in a direction away from the bonding electrode and defining a groove concave in a direction facing the bonding electrode, and a second protrusion protruding in a direction away from the bonding electrode in the groove of the first protrusion.

Abstract: In a method of manufacturing a display device, the method includes aligning a metal layer of a transfer substrate and a display substrate to face each other, attaching a light emitting element including a metal protrusion portion bonded to the metal layer to an overcoat layer of the display substrate by moving the transfer substrate relative to the display substrate, and separating the metal protrusion portion from the light emitting element by moving the transfer substrate relative to the display substrate.

Abstract: In a method of manufacturing a display device, the method includes forming a first electrode on a substrate, forming an insulating layer over the first electrode, aligning a first light emitting element on the insulating layer, light-exposing the insulating layer, exposing at least a portion of the first electrode by developing the insulating layer, and bonding the first light emitting element to the at least a portion of the first electrode.

Abstract: A light-emitting element includes a core including a first semiconductor layer including a first portion and a second portion, the first and second portions having side surfaces at different inclinations, a second semiconductor layer disposed on the first semiconductor layer, and an emissive layer disposed between the first semiconductor layer and the second semiconductor layer; a first insulating layer surrounding the first portion of the first semiconductor layer; and a second insulating layer surrounding the second portion of the first semiconductor layer.

Abstract: A display device includes light emitting elements each including a first area and a second area having different diameters, and a base layer surrounding the first area of the light emitting elements and contacting the first area of each of the light emitting elements. The second area of each of the light emitting elements protrudes from a first surface of the base layer.

Abstract: A display device includes a first substrate including a first contact hole, fan-out lines in a first metal layer, a second substrate on the first metal layer and including a second contact hole, connection lines in a second metal layer and into the second contact hole connected to the fan-out lines, a thin film transistor in an active layer and a third metal layer on the second metal layer, and a flexible film on a surface of the first substrate and into the first contact hole connected to the fan-out lines. An etching angle of the first contact hole between a top surface of the first substrate and an inner surface of the first contact hole is less than an etching angle of the second contact hole between top surfaces of the fan-out lines and an inner surface of the second contact hole.

Abstract: A deposition mask includes: a plurality of sub-masks through which deposition material passes to a base layer to form a deposition layer defining a hole therein, each of the sub-masks including: an aperture through which the deposition material passes to the base layer, a total planar area of the aperture corresponding to less than a total planar area of the deposition layer, and a masking surface at which the deposition material does not pass through the sub-mask, the masking surface including a hole-forming portion of which a total planar area thereof corresponds to a total planar area of the hole defined in the deposition layer. The hole-forming portions of the sub-masks have a same shape and planar area as each other, and within each sub-mask, the shape of the hole-forming portion is nested within a shape of the aperture.

Abstract: A deposition mask includes: a plurality of sub-masks through which deposition material passes to a base layer to form a deposition layer defining a hole therein, each of the sub-masks including: an aperture through which the deposition material passes to the base layer, a total planar area of the aperture corresponding to less than a total planar area of the deposition layer, and a masking surface at which the deposition material does not pass through the sub-mask, the masking surface including a hole-forming portion of which a total planar area thereof corresponds to a total planar area of the hole defined in the deposition layer. The hole-forming portions of the sub-masks have a same shape and planar area as each other, and within each sub-mask, the shape of the hole-forming portion is nested within a shape of the aperture.

Abstract: A deposition mask includes: a plurality of sub-masks through which deposition material passes to a base layer to form a deposition layer defining a hole therein, each of the sub-masks including: an aperture through which the deposition material passes to the base layer, a total planar area of the aperture corresponding to less than a total planar area of the deposition layer, and a masking surface at which the deposition material does not pass through the sub-mask, the masking surface including a hole-forming portion of which a total planar area thereof corresponds to a total planar area of the hole defined in the deposition layer. The hole-forming portions of the sub-masks have a same shape and planar area as each other, and within each sub-mask, the shape of the hole-forming portion is nested within a shape of the aperture.

Abstract: A deposition mask includes: a plurality of sub-masks through which deposition material passes to a base layer to form a deposition layer defining a hole therein, each of the sub-masks including: an aperture through which the deposition material passes to the base layer, a total planar area of the aperture corresponding to less than a total planar area of the deposition layer, and a masking surface at which the deposition material does not pass through the sub-mask, the masking surface including a hole-forming portion of which a total planar area thereof corresponds to a total planar area of the hole defined in the deposition layer. The hole-forming portions of the sub-masks have a same shape and planar area as each other, and within each sub-mask, the shape of the hole-forming portion is nested within a shape of the aperture.

Abstract: An organic light emitting diode (OLED) display includes a base substrate, a first electrode on the base substrate, a pixel definition layer on the first electrode and having an opening exposing the first electrode, spacers on the pixel definition layer and having a smaller modulus than the pixel definition layer, an organic emission layer on the first electrode to correspond to the opening, and a second electrode on the organic emission layer.

Abstract: An organic light emitting diode (OLED) display includes a base substrate, a first electrode on the base substrate, a pixel definition layer on the first electrode and having an opening exposing the first electrode, spacers on the pixel definition layer and having a smaller modulus than the pixel definition layer, an organic emission layer on the first electrode to correspond to the opening, and a second electrode on the organic emission layer.