Abstract: A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axi

Abstract: A method for determining a spatial relationship between an optoelectronic chip and an optical mount, the method may include temporarily filling, by a liquid, a gap formed between a lens of the optical mount and the optoelectronic chip, while the optical mount contacts the optoelectronic chip; inspecting an optical component of the optoelectronic chip through the lens and through the liquid that fills the gap; and determining the spatial relationship between the optoelectronic chip and the optical mount based on the outcome of the inspecting of the optical component.

Abstract: A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axi

Abstract: A method for determining a spatial relationship between an optoelectronic chip and an optical mount, the method may include temporarily filling, by a liquid, a gap formed between a lens of the optical mount and the optoelectronic chip, while the optical mount contacts the optoelectronic chip; inspecting an optical component of the optoelectronic chip through the lens and through the liquid that fills the gap; and determining the spatial relationship between the optoelectronic chip and the optical mount based on the outcome of the inspecting of the optical component.