Abstract: An apparatus includes a first wall and a second wall extending from a planar surface of a substrate to a wall height, and a plurality of electrodes disposed on the first wall and the second wall. The first wall and the second wall can be spaced apart from one another along a first axis on the planar surface. The plurality of electrodes can be configured to generate an electric field to trap an ion at a trapping position located between the first wall and the second wall. A vertical distance between the trapping position and the planar surface of the substrate can be smaller than the wall height.

Abstract: Methods and systems for fabricating 3D electronic devices, such as multielectrode arrays, including metalized, 3D printed structures using integrated 3D printing and photolithography techniques are disclosed. As one embodiment, a multielectrode array comprises a flexible substrate, a plurality of photopatterned electrical traces spaced apart and insulated from one another on the substrate, and a plurality of 3D printed electrodes. Each 3D printed electrode comprises a photopolymer coated in metal and has a 3D structure that extends outward from the substrate, and each 3D printed electrode is electrically connected to a corresponding electrical trace of the plurality of photopatterned electrical traces.

Abstract: Methods and systems for fabricating 3D electronic devices, such as multielectrode arrays, including metalized, 3D printed structures using integrated 3D printing and photolithography techniques are disclosed. As one embodiment, a multielectrode array comprises a flexible substrate, a plurality of photopatterned electrical traces spaced apart and insulated from one another on the substrate, and a plurality of 3D printed electrodes. Each 3D printed electrode comprises a photopolymer coated in metal and has a 3D structure that extends outward from the substrate, and each 3D printed electrode is electrically connected to a corresponding electrical trace of the plurality of photopatterned electrical traces.

Abstract: Architecture that facilitates the virtual specification of a connection between physical endpoints. A network can be defined as an abstract connectivity model expressed in terms of the connectivity intent, rather than any specific technology. The connectivity model is translated into configuration settings, policies, firewall rules, etc., to implement the connectivity intent based on available physical networks and devices capabilities. The connectivity model defines the connectivity semantics of the network and controls the communication between the physical nodes in the physical network. The resultant virtual network may be a virtual overlay that is independent of the physical layer. Alternatively, the virtual overlay can also include elements and abstracts of the physical network(s). Moreover, automatic network security rules (e.g., Internet Protocol security-IPSec) can be derived from the connectivity model of the network.

Abstract: Architecture that facilitates the virtual specification of a connection between physical endpoints. A network can be defined as an abstract connectivity model expressed in terms of the connectivity intent, rather than any specific technology. The connectivity model is translated into configuration settings, policies, firewall rules, etc., to implement the connectivity intent based on available physical networks and devices capabilities. The connectivity model defines the connectivity semantics of the network and controls the communication between the physical nodes in the physical network. The resultant virtual network may be a virtual overlay that is independent of the physical layer. Alternatively, the virtual overlay can also include elements and abstracts of the physical network(s). Moreover, automatic network security rules (e.g., Internet Protocol security-IPSec) can be derived from the connectivity model of the network.