Patents by Inventor Morgan CHENE

Morgan CHENE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10577522
    Abstract: Flexible films comprise an adhesive layer and a fibrous supporting layer and the thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates where they can reduce the formation of galvanic corrosion.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: March 3, 2020
    Assignee: ZEPHYROS, INC.
    Inventors: Michel Awkal, Morgan Chene
  • Patent number: 10570317
    Abstract: An adhesive comprising a solvent free powder of average particle size in the range 20 to 300 preferably 20 to 150 microns is heat activated at a temperature in the range 140° C. to 220° C., is flowable at a temperature below the heat activation temperature and is dry and non-tacky to the touch at ambient temperature, the use of a powdered adhesive is particularly useful for bonding of non-planar surfaces with complex contours.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: February 25, 2020
    Assignee: ZEPHYROS, INC.
    Inventors: Morgan Chene, Christophe Henry
  • Patent number: 10279514
    Abstract: Spherical heat foamable pellets (2) are used for reinforcing honeycomb structures (4). The pellets are preferably of average diameter from 0.5 mm to 0.9 mm and preferably at least 80% of the pellets have a diameter in this range. The pellets can form a free flowing stream which can be poured into the cells (5) of the honeycomb where they can be foamed by heating to form a reinforcing foam which can also bond the honeycomb structure to facing sheets. It is preferred that the pellets are based on a thermosetting resin and contain a curing agent that can cure the foamed resin to produce an integral rigid reinforcing foam within the cells of the honeycomb.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: May 7, 2019
    Assignee: Zephyros, Inc.
    Inventors: Francis Meyer, Morgan Chene
  • Publication number: 20170081555
    Abstract: An adhesive comprising a solvent free powder of average particle size in the range 20 to 300 preferably 20 to 150 microns is heat activated at a temperature in the range 140° C. to 220° C., is flowable at a temperature below the heat activation temperature and is dry and non-tacky to the touch at ambient temperature, the use of a powdered adhesive is particularly useful for bonding of non-planar surfaces with complex contours.
    Type: Application
    Filed: March 30, 2015
    Publication date: March 23, 2017
    Inventors: Morgan Chene, Christophe Henry
  • Publication number: 20160243733
    Abstract: Spherical heat foamable pellets (2) are used for reinforcing honeycomb structures (4). The pellets are preferably of average diameter from 0.5 mm to 0.9 mm and preferably at least 80% of the pellets have a diameter in this range. The pellets can form a free flowing stream which can be poured into the cells (5) of the honeycomb where they can be foamed by heating to form a reinforcing foam which can also bond the honeycomb structure to facing sheets. It is preferred that the pellets are based on a thermosetting resin and contain a curing agent that can cure the foamed resin to produce an integral rigid reinforcing foam within the cells of the honeycomb.
    Type: Application
    Filed: October 20, 2014
    Publication date: August 25, 2016
    Inventors: Francis Meyer, Morgan Chene
  • Publication number: 20160160092
    Abstract: Flexible films comprise an adhesive layer and a fibrous supporting layer and the thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates where they can reduce the formation of galvanic corrosion.
    Type: Application
    Filed: July 25, 2014
    Publication date: June 9, 2016
    Inventors: Michel AWKAL, Morgan CHENE