Abstract: A coated phosphor including: an inorganic phosphor particle; and a silicon oxide coating that coats the inorganic phosphor particle, wherein a molar ratio (O/Si) of an oxygen atom to a silicon atom in the silicon oxide coating through ICP emission spectroscopy of the coated phosphor is 2.60 or less.

Abstract: A green phosphor including: (i) an inorganic phosphor particle; and (ii) neodymium-containing particles attached on a surface of the inorganic phosphor particle, wherein the green phosphor has a light-emission local maximum wavelength in a range of from 500 nm to 570 nm.

Abstract: A coated phosphor including: an inorganic phosphor particle; and a silicon oxide coating that coats the inorganic phosphor particle, wherein a molar ratio (O/Si) of an oxygen atom to a silicon atom in the silicon oxide coating through ICP emission spectroscopy of the coated phosphor is 2.60 or less.

Abstract: A coated phosphor including: an inorganic phosphor particle; and a silicon oxide coating that coats the inorganic phosphor particle, wherein a molar ratio (O/Si) of an oxygen atom to a silicon atom in the silicon oxide coating through ICP emission spectroscopy of the coated phosphor is 2.60 or less.

Abstract: A green phosphor including: (i) an inorganic phosphor particle; and (ii) neodymium-containing particles attached on a surface of the inorganic phosphor particle, wherein the green phosphor has a light-emission local maximum wavelength in a range of from 500 nm to 570 nm.

Abstract: A green phosphor including: (i) an inorganic phosphor particle; and (ii) neodymium-containing particles attached on a surface of the inorganic phosphor particle, wherein the green phosphor has a light-emission local maximum wavelength in a range of from 500 nm to 570 nm.

Abstract: A coated phosphor including: an inorganic phosphor particle; and a silicon oxide coating that coats the inorganic phosphor particle, wherein a molar ratio (O/Si) of an oxygen atom to a silicon atom in the silicon oxide coating through ICP emission spectroscopy of the coated phosphor is 2.60 or less.

Abstract: A green phosphor including: (i) an inorganic phosphor particle; and (ii) neodymium-containing particles attached on a surface of the inorganic phosphor particle, wherein the green phosphor has a light-emission local maximum wavelength in a range of from 500 nm to 570 nm.

Abstract: A light-emitting device includes a light-emitting element; one or more silver-based members having silver on their surfaces; and a resin layer including a first resin layer covering at least one of the silver-based members, and a second resin layer placed directly on the first resin layer. The light-emitting element is covered with the first resin layer or both the first resin layer and the second resin layer, at least one of the first resin layer and the second resin layer contains an inorganic adsorbent which chemically adsorbs a sulfide, the second resin layer contains a sulfide-based phosphor, and a ratio of a thickness of the first resin layer with respect to a total thickness of the first resin layer and the second resin layers is 50% or more.

Abstract: A red fluorescent substance including: element A, europium (Eu), silicon (Si), aluminum (Al), oxygen (O), and nitrogen (N) at ratios of numbers of atoms in Compositional Formula (1) below. [A(m?x)Eux]Si9AlyOnN[12+y?2(n?m)/3]??Compositional Formula (1) In the Compositional Formula (1), the element A is a Group 2 element including calcium (Ca) and barium (Ba), m, x, y, and n in the Compositional Formula (1) satisfy 3<m<5, 0<x<1, 0.012?y?0.10, and 0<n<10, respectively and when a ratio of the number of Ca atoms is ? and a ratio of the number of Ba atoms is ?, the Compositional Formula (I) satisfies Formula (I) below: 0.05??/(?+?)<1.00??Formula (I).

Abstract: Provided are a red phosphor having increased reflectivity in a green color gamut and a production method therefor, and a white light source, an illumination device, and a display device using the same. A red phosphor comprises a composition containing an alkaline earth metal element (A), europium (Eu), silicon (Si), aluminum (Al), oxygen (O), and nitrogen (N) at atomic ratios in the following Formula (1), and further containing carbon (C), [A(m-x)Eux]Si9AlyOnN{12+y-2(n-m)/3}??(1) where m, n, x, and y respectively satisfy 3<m<5, 0<n<10, 0<x<1, and 0<y<2, wherein the alkaline earth metal element (A) includes at least barium (Ba).

Abstract: A micro-lens substrate having a precise micro-lens array suitable for higher resolution, the micro-lens array substrate of high quality without having a distortion, and a method for manufacturing thereof are provided. In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate.

Abstract: Disclosed herein is a method for manufacturing a microlens substrate which is excellent in chemical resistance and light fastness to intense light irradiation, and is capable of forming a microlens substrate of a high accuracy of form. The method includes the steps of: forming a lens-shaped curve at a surface side of a transparent substrate; forming an inorganic material film on the transparent substrate so as to bury the curve therewith; and planarizing the surface of the inorganic material film to provide a microlens where the curve is buried with the inorganic material film.

Abstract: In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate.

Abstract: A micro-lens substrate having a precise micro-lens array suitable for higher resolution, the micro-lens array substrate of high quality without having a distortion, and a method for manufacturing thereof are provided. In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate.

Abstract: A micro-lens substrate having a precise micro-lens array suitable for higher resolution, the micro-lens array substrate of high quality without having a distortion, and a method for manufacturing thereof are provided. In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate.

Abstract: Disclosed herein is a method for manufacturing a microlens substrate which is excellent in chemical resistance and light fastness to intense light irradiation, and is capable of forming a microlens substrate of a high accuracy of form. The method includes the steps of: forming a lens-shaped curve at a surface side of a transparent substrate; forming an inorganic material film on the transparent substrate so as to bury the curve therewith; and planarizing the surface of the inorganic material film to provide a microlens where the curve is buried with the inorganic material film.

Abstract: Disclosed herein is a method for manufacturing a microlens substrate which is excellent in chemical resistance and light fastness to intense light irradiation, and is capable of forming a microlens substrate of a high accuracy of form. The method includes the steps of: forming a lens-shaped curve at a surface side of a transparent substrate; forming an inorganic material film on the transparent substrate so as to bury the curve therewith; and planarizing the surface of the inorganic material film to provide a microlens where the curve is buried with the inorganic material film.

Abstract: A master base for fabrication includes a substrate, a first photoresist layer disposed on the substrate, and a second photoresist layer disposed on the first photoresist layer, wherein the first photoresist layer attenuates or absorbs rays reflected at the interface between the first photoresist layer and the substrate to prevent the reflected rays from interfering with applied rays in a exposing step. A method for manufacturing a master base for fabrication includes the steps of forming a first photoresist layer on a substrate, baking the first photoresist layer at the setting temperature of the first photoresist layer, and forming a second photoresist layer on the first photoresist layer.

Abstract: A master base for fabrication includes a substrate, a first photoresist layer disposed on the substrate, and a second photoresist layer disposed on the first photoresist layer, wherein the first photoresist layer attenuates or absorbs rays reflected at the interface between the first photoresist layer and the substrate to prevent the reflected rays from interfering with applied rays in a exposing step. A method for manufacturing a master base for fabrication includes the steps of forming a first photoresist layer on a substrate, baking the first photoresist layer at the setting temperature of the first photoresist layer, and forming a second photoresist layer on the first photoresist layer.