Patents by Inventor Morihiko Hamada

Morihiko Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe card, having cantilever-type probe and method
    Patent number: 7256591
    Abstract: A probe card is used to test an electronic device. The probe card includes a base plate and a cantilever-type probe arranged on the base plate. The cantilever-type probe has an end that contacts the contacted body and moves when contacting the contacted body. A stopper arranged on the base plate restricts the movement of the cantilever-type probe.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: August 14, 2007
    Assignee: Fujitsu Limited
    Inventors: Tsutomu Tatematsu, Kenji Togashi, Tetsuhiro Nanbu, Shigenobu Ishihara, Morihiko Hamada, Yoshikazu Arisaka, Kunihiro Itagaki, Shigekazu Aoki
  • Self-testing circuit in semiconductor memory device
    Patent number: 7171592
    Abstract: A semiconductor memory device includes a self-testing circuit and a self-redundancy circuit with simple structures. The self-testing circuit includes a comparison circuit which compares write data with read data with respect to normal memory blocks and redundant memory blocks, and a decision circuit which decides if the semiconductor memory device is good or defective based on the plurality of comparison result signals. A signal transfer and holding circuit is connected between the comparison circuit and the decision circuit to transfer the plurality of comparison result signals to the decision circuit and to supply the plurality of comparison result signals to the self-redundancy circuit as a test result.
    Type: Grant
    Filed: February 10, 2003
    Date of Patent: January 30, 2007
    Assignee: Fujitsu Limited
    Inventors: Kenji Togashi, Morihiko Hamada, Shigekazu Aoki, Katsumi Shigenobu, Yukio Saka, Yoshikazu Arisaka, Toyoji Sawada, Tadashi Asai
  • Semiconductor testing apparatus for conducting conduction tests
    Patent number: 6765401
    Abstract: A semiconductor testing apparatus for conducting a conduction test after stabilizing contact between probing pins and a wafer is provided. The semiconductor testing apparatus includes a heat transfer block which is contacted to the probing pins to adjust the temperature of the probing pins to a predetermined testing temperature before the probing pins are brought into contact with the wafer.
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: July 20, 2004
    Assignee: Fujitsu Limited
    Inventor: Morihiko Hamada
  • Semiconductor testing apparatus
    Publication number: 20030222670
    Abstract: A semiconductor testing apparatus for conducting a conduction test after stabilizing contact between probing pins and a wafer is provided. The semiconductor testing apparatus includes a heat transfer block which is contacted to the probing pins to adjust the temperature of the probing pins to a predetermined testing temperature before the probing pins are brought into contact with the wafer.
    Type: Application
    Filed: January 3, 2003
    Publication date: December 4, 2003
    Applicant: FUJITSU LIMITED
    Inventor: Morihiko Hamada
  • Self-testing circuit in semiconductor memory device
    Publication number: 20030177415
    Abstract: A semiconductor memory device includes a self-testing circuit and a self-redundancy circuit with simple structures. The self-testing circuit includes a comparison circuit which compares write data with read data with respect to normal memory blocks and redundant memory blocks, and a decision circuit which decides if the semiconductor memory device is good or defective based on the plurality of comparison result signals. A signal transfer and holding circuit is connected between the comparison circuit and the decision circuit to transfer the plurality of comparison result signals to the decision circuit and to supply the plurality of comparison result signals to the self-redundancy circuit as a test result.
    Type: Application
    Filed: February 10, 2003
    Publication date: September 18, 2003
    Applicant: Fujitsu Limited
    Inventors: Kenji Togashi, Morihiko Hamada, Shigekazu Aoki, Katsumi Shigenobu, Yukio Saka, Yoshikazu Arisaka, Toyoji Sawada, Tadashi Asai
  • Probe card and probe contact method
    Publication number: 20030098702
    Abstract: An inexpensive probing card that has probe pins for contacting pads with high reliability. The probe pins are arranged on a base plate. The probe pins move along the pads when contacting the pads. A stopper restricts the movement of the probe pins.
    Type: Application
    Filed: March 29, 2002
    Publication date: May 29, 2003
    Applicant: Fujitsu Limited
    Inventors: Tsutomu Tatematsu, Kenji Togashi, Tetsuhiro Nanbu, Shigenobu Ishihara, Morihiko Hamada, Yoshikazu Arisaka, Kunihiro Itagaki
  • Probe card, semiconductor device testing apparatus, and probe contact method
    Publication number: 20030098701
    Abstract: An inexpensive probing card that has probe pins for contacting pads with high reliability. The probe pins are arranged on a base plate. The probe pins move along the pads when contacting the pads. A stopper restricts the movement of the probe pins.
    Type: Application
    Filed: October 31, 2002
    Publication date: May 29, 2003
    Applicant: Fujitsu Limited
    Inventors: Tsutomu Tatematsu, Kenji Togashi, Tetsuhiro Nanbu, Shigenobu Ishihara, Morihiko Hamada, Yoshikazu Arisaka, Kunihiro Itagaki, Shigekazu Aoki